Datasheet

11© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com FS8001_EF • 3/27/2017
Flex Suppressor
®
EF Series
Soldering Process
230
200
150
Preheating
A
B
Peak Temperature (ºC)
Time (seconds)
Reflow Profile
Peak Temperature
+260°C
Preheating 150 – 180°C 90 seconds maximum
A
200°C or more, 60 seconds
maximum
B
230°C or more, 40 seconds
maximum
Number of Times 2 times maximum
Handling Precautions
Avoid high-temperature, humidity and direct sunlight. Storage environment should be below 40°C and below 70% relative
humidity.
The surface resistance value listed in this catalog is a reference value of the circuit parameter to indicate noise
suppression. The value does not mean the product’s insulation characteristics. The value may become lower if an excess
pressure is applied to the product.
Products in this catalog are not insulators. Please handle them as conductors. When in actual use, please be careful so that
conductive material does not contact the surface or the edge of the Flex Suppressor
®
sheet. Insulation process should be
performed when contact to conductive material is probable.
Depending upon the processing procedure, powdery substance may drop out from sheet surface or edge if cutting of the
sheet is performed by the customer. Please be careful as this powder may effect the component’s performance depending
on the location.
Clean away any dust, oil or moisture from the surface of the installing area when attaching the sheet using adhesive tape.