Datasheet

11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F3086_F161 • 3/18/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Film Surface Mount Capacitors – General Purpose and High Stability
F161 Encapsulated Stacked, Size 2220 – 6560, 50 – 400 VDC
Carrier Taping & Packaging (IEC 60286–2)
Horizontal Taping Orientation
4.0 ±0.1
P
1
A
0
K
0
Direction of Unreeling
Ø1.5
+0.1
−0
2.0 ±0.05
1.75 ±0.1
W
EIA Size
Code
Horizontal
Mounting
Size Code
Dimensions in mm Taping Speci cation
B H L W P
1
A
0
B
0
K
0
D W
1
W
2
Nominal
Nominal
Nominal
−0/+0.3
±0.1
Nominal
Nominal
Nominal
±2.0
−0/+2
Maximum
2220
PP
5.0
3.0
5.7
12.0
8.0
5.5
6.0
3.3
330
12.4
22.0
2220
PU
5.0
4.0
5.7
12.0
8.0
5.5
6.0
4.3
330
12.4
22.0
2824
SL
6.0
3.0
7.3
12.0
8.0
6.5
7.5
3.3
330
12.4
22.0
2824
SP
6.0
3.5
7.3
12.0
8.0
6.5
7.5
3.8
330
12.4
22.0
2824
ST
6.0
4.5
7.3
12.0
8.0
6.5
7.5
4.8
330
12.4
22.0
4036
WP
9.1
5.5
10.2
16.0
16.0
9.5
10.5
5.8
330
16.4
22.0
5045
YR
11.5
6.5
12.7
24.0
16.0
11.9
13.1
6.8
330
24.4
30.0
6560
ZS
15.0
7.0
16.5
24.0
20.0
15.4
16.8
7.3
330
24.4
30.0
D
W
2
W
1
Landing
Mounting Chip Size
Dimensions in mm
A B X
Horizontal
2220
5.1
1.5
3.0
2824
6.1
1.5
3.8
4036
9.1
2.0
5.5
5045
11.6
2.5
7.0
6560
15.0
3.0
9.0
Vertical
4022
5.6
2.0
5.5
5026
6.6
2.5
7.0
6528
7.1
3.0
9.0
B
X
X
A