Datasheet

ManualsBrandsKEMET ManualsInductorsInductor, SMD, 1.5uH, 1.3A, 0.09Ohm

1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard L9014_L-DMI • 4/17/2020

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

One world. One KEMET

Benets

• Unique green sheet and printing technologies

• High reliability

• High current

• Low DCR

• Lowprole1.2mmmaximum

Chip Inductors

High Current Multilayer Chip Power Inductor L-DMI

Part Number System

L 0603 C 1R0 M DMI T

Inductor

EIA Case Size

(L"xW")

Specication

Inductance

Value(µH)

Inductance

Tolerance

Series Packaging

0603(1608inmm)

0805(2012inmm)

0806(2016inmm)

1008(2520inmm)

C = Commercial

L=0.8mmmaximumheight

S = High saturation type

Q=1.2mmmaximumheight

R = decimal point

Examples:

R47 = 0.47 µH

1R0 = 1.0 µH

M = ±20% DMI = High current

multilayer chip type

T = Tape & Reel

Overview

KEMET L-DMI ferrite-based Multilayer Chip Power

Inductors are ideal for use in DC to DC switching power

supplies. The small size of this chip inductor makes it

suitable for mobile equipement that requires tight space

both in dimension and in height. The internal printed coil

structure creates a closed magnetic circuit, which acts as

a magnetic shield eliminating crosstalk, thus permitting

higher mounting densities. The multilayer block structure

yields higher reliability. In addition, the inductor shows

excellentlowDCpowerdissipation,duetolowRdcwith

a high aspect ratio internal conductor that stands on

unique green sheet and printing technologies.

Applications

• Switching DC-DC power supplies

• Wearables

• Smartphone

• Tablet device

• Digital still camera

• HDD

Summary of content (12 pages)

PAGE 1
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Overview Applications KEMET L-DMI ferrite-based Multilayer Chip Power Inductors are ideal for use in DC to DC switching power supplies. The small size of this chip inductor makes it suitable for mobile equipement that requires tight space both in dimension and in height. The internal printed coil structure creates a closed magnetic circuit, which acts as a magnetic shield eliminating crosstalk, thus permitting higher mounting densities.
PAGE 2
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Dimensions – Millimeters (Inches) Dimensions - Millimeters (Inches) W Land Pattern - Millimeters Land Pattern L Chip Inductor B T Solder−resist C B A B EIA Size Code Metric Size Code L Length W Width T Thickness B Bandwidth A B C 0603 1608 1.60 (0.063) ±0.15 (0.006) 0.80 (0.031) ±0.15 (0.006) 0.95 (0.037) Maximum 0.30 (0.012) ±0.20 (0.008) 0.8 ~ 1.0 0.6 ~ 0.8 0.6 ~ 0.8 0805 2012 0.50 (0.020) ±0.30 (0.012) 0.
PAGE 3
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Environmental Compliance All KEMET Chip Inductors are RoHS and REACH Compliant. Table 1 – Ratings & Part Number Reference 1 Part Number "Inductance (µH) at 1 MHz" Inductance Tolerance DC Resistance (mΩ) Typical DC Resistance (mΩ) Maximum Rated Current (A) Maximum1 L0603CR50MDMIT 0.50 ±20% L0603C1R0MDMIT 1.00 ±20% 0.12 0.150 0.90 0.17 0.200 L0603C2R2MDMIT 2.20 0.75 ±20% 0.27 0.300 0.
PAGE 4
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI DC-Superposed Characteristics L0603CR50MDMIT Inductance (µH) Inductance (µH) L0603C1R0MDMIT Idc (A) Idc (A) Inductance (µH) L0805CR47MDMIT Inductance (µH) L0603C2R2MDMIT Idc (A) Inductance (µH) L0805C1R5MDMIT Inductance (µH) L0805C1R0MDMIT Idc (A) Idc (A) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.
PAGE 5
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI DC-Superposed Characteristics cont. Inductance (µH) L0805C3R3MDMIT Inductance (µH) L0805C2R2MDMIT Idc (A) Inductance (µH) L0806CR47MDMIT Inductance (µH) L0805C4R7MDMIT Idc (A) Idc (A) Inductance (µH) L0806C1R5MDMIT Inductance (µH) L0806C1R0MDMIT Idc (A) Idc (A) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.
PAGE 6
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI DC-Superposed Characteristics cont. L0806C3R3MDMIT Inductance (µH) Inductance (µH) L0806C2R2MDMIT Idc (A) Idc (A) Inductance (µH) L1008CR47MDMIT Inductance (µH) L0806C4R7MDMIT Idc (A) Inductance (µH) L1008C1R5MDMIT Inductance (µH) L1008C1R0MDMIT Idc (A) Idc (A) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.
PAGE 7
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI DC-Superposed Characteristics cont. L1008C3R3MDMIT Inductance (µH) Inductance (µH) L1008C2R2MDMIT Idc (A) Idc (A) Inductance (µH) L1008L1R5MDMIT Inductance (µH) L1008C4R7MDMIT Idc (A) Inductance (µH) L1008S1R0MDMIT Inductance (µH) L1008L2R2MDMIT Idc (A) Idc (A) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.
PAGE 8
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Taping Specifications - Millimeters (Inches) 0603 Paper Tape 8mm Width A B T 8.0±0.3 (0.315±0.012) 1.75±0.1 (0.069±0.004) 3.5±0.05 (0.138±0.002) Ø1.5±0.1/−0 (Ø0.059±0.004/−0) Sprocket Hole F 3.0±0.05 (0.079±0.002) 4.0±0.1 (0.157±0.004) EIA Case Size Metric Case Size Height Reel Quantity 0603 1608 0.8 4,000 Cavity Pitch Thickness A B P T Nominal 1.0 1.8 4.0 1.1 Tolerance ±0.2 ±0.2 ±0.
PAGE 9
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Taping Specifications - Millimeters (Inches) cont. 0805, 0806, 1008 Embossed (Plastic) Tape 8mm Width 1.75±0.1 (0.069±0.004) A B T 8.0±0.3 (0.315±0.012) 3.5±0.05 (0.138±0.002) Ø1.5±0.1/−0 (Ø0.059±0.004/−0) Sprocket Hole K F 3.0±0.05 (0.079±0.002) EIA Metric Case Size Case Size 4.0±0.1 (0.157±0.004) Height Reel Quantity Cavity Pitch A B P Nominal 1.55 2.30 4.00 Tolerance ±0.2 ±0.2 ±0.1 Nominal 1.80 2.20 4.
PAGE 10
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Reel Specifications - Millimeters t E C B D R A W Dimensions - Millimeters Series L-DMI A B C D E R t W Nominal ø178.0 ø60.0 ø13.0 ø21.0 2.0 1.0 2.5 10.0 Tolerance ±2.0 Minimum ±0.2 ±0.8 ±0.5 Maximum ±1.5 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.
PAGE 11
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI Recommended Reflow Soldering Profile Temperature 300°C Peak 260°C maximum 10 seconds maximum 200°C Heating above 230°C 40 seconds maximum 100°C Preheating 150°C 60 seconds minimum 0°C Time Handling Precautions Inductors should be stored in normal working environments.
PAGE 12
Chip Inductors High Current Multilayer Chip Power Inductor L-DMI KEMET Electronics Corporation Sales Oﬃces For a complete list of our global sales oﬃces, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change.