Datasheet

© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1102_KPS-MCL_200C_STACKS • 3/31/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
6
Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCL Low-Loss High Temperature 200°C SMPS Stacks, 200 – 2,000 VDC (Industrial Grade)
Soldering Process
The capacitors and assemblies outlined in this specication sheet are susceptible to thermal shock damage due to their
large ceramic mass. Temperature proles used should provide adequate temperature rise and cool-down time to prevent
damage from thermal shock. In general, KEMET recommends against hand-soldering for these types of large ceramic
devices, but if hand-soldering cannot be avoided, refer to hand-soldering section below.
Recommended Soldering Technique:
• Solder reow
Recommended Reow Soldering Prole:
Time
Temperature
T
smin
25
T
smax
T
L
T
P
Maximum Ramp Up Rate = 2°C/second
Maximum Ramp Down Rate = 2°C/second
t
P
t
L
t
s
25°C to Peak
Prole Feature Sn-Pb Pb-Free
Preheat/Soak
Temperature Minimum (T
Smin
)
100°C
150°C
Temperature Maximum (T
Smax
)
150°C
200°C
Time (t
s
) from T
smin
to T
smax
)
60 – 90 seconds
60 – 120 seconds
Ramp-up rate (T
L
to T
P
)
2°C/second
3°C/second
Liquidous temperature (T
L
)
183°C
217°C
Time above liquidous (t
L
)
95 seconds
95 seconds
Peak temperature (T
P
)
240°C
260°C
Time within 5°C of maximum peak
temperature (t
P
)
5 seconds 5 seconds
Ramp-down rate (T
P
to T
L
)
2°C/second
2°C/second
Time 25°C to peak temperature
3.5 minutes
3.5 minutes
Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reow.
Preheating and Reow Prole Notes:
Due to the differences in the coecient of the thermal expansion for the different materials of construction, it is critical to monitor and control the heating
and cooling rates during the soldering process. To ensure optimal component reliability, KEMET's recommended heating and cooling rate is 2°C/second.
After soldering, the capacitors should be air cooled to room temperature before further processing. Forced air cooling is not recommended.