Datasheet

© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1102_KPS-MCL_200C_STACKS 3/31/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
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Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCL Low-Loss High Temperature 200°C SMPS Stacks, 200 – 2,000 VDC (Industrial Grade)
Soldering Process cont.
Recommendations for Hand-Soldering:
Care should be taken when hand-soldering large ceramic stacks. Excessive thermal shock on the ceramic material can lead
to cracking and reliability issues. To reduce risk of thermal shock, KEMET recommends solder reow, but if hand soldering
cannot be avoided, please see recommended guidelines below.
Pre-Heating
Stacks should be preheated to a temperature within 50°C of reow temperature. KEMET recommends a ramp rate of 2°C/
second to avoid thermal shock during the pre-heating process.
Hand-Soldering
When using a solder iron, keep tip of the iron as far away from ceramic body to avoid excessive heating.
Cool Down
After reow, stacks should be allowed to cool at a preferable rate of 2°C/second until room temperature is reached.
Storage & Handling
Ceramic capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels and may soften or warp,
and tape peel force may increase. KEMET recommends that maximum storage temperature does not exceed 40°C and
maximum storage humidity does not exceed 70% relative humidity. Temperature uctuations should be minimized to
avoid condensation on the parts. Atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability chip stock should be used promptly, preferably within 1.5 years of receipt.