Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 10
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Production process basic suggestions
In case of: Typical cause Typical solution
no solder joint on one
end termination
landing area dimensions see landing areas suggestions, page 9
solder paste quality see solder paste suggestions, page 9
not-uniform solder paste thickness
on the landing areas
set the dispensing solder paste machine properly
wrong position of the capacitor
on the landing areas
set the pick and place machine properly
thermal prole temperature see reow recommendations, page 7
bad temperature distribution
in the reow oven
check the reow oven temperature
distribution and variations"
no solder joint on both
end termination
landing area dimensions see landing areas suggestions, page 9
solder paste quality see solder paste suggestions, page 9
no solder paste on the landing areas set the dispensing solder paste machine properly
thermal prole temperature see reow recommendations, page 7
bad temperature distribution
in the reow oven
check the reow oven temperature
distribution and variations
oxidated end terminations see moisture recommendations, page 8
capacitor's body
mechanical deformation
too long time over 217°C see reow recommendations, page 7
too long time within T
max
and T
max
−5°C see reow recommendations, page 7
too high temperature ramp rate see reow recommendations, page 7
capacitor damaged by a soldering iron see manual soldering recommendations, page 8
capacitance drop (up to 20%)
too long time over 217°C see reow recommendations, page 7
too long time within T
max
and T
max
−5°C see reow recommendations, page 7
too high temperature ramp rate see reow recommendations, page 7
capacitor damaged by a soldering iron see manual soldering recommendations, page 8
capacitance drop (over 20%)
capacitor damaged by a soldering iron see manual soldering recommendations, page 8
Note: small ssures on the capacitor’s cutting surface are actually slight detachments of two adjacent metallized lm layers and have to be considered
only as an aesthetic issue related to the SMD Film Capacitors’ manufacturing process and technology.
Therefore, small ssures on SMD Film Capacitors are not comparable to cracks on SMD Ceramics.
Fissures do not inuence in anyway SMD Film Capacitors’ reliability.