Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 11
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Carrier Taping & Packaging (IEC 60286–2)
Horizontal Taping Orientation
L
SMD Film Capacitor (Top View) Tape Reel
P±0.1
2.0±0.05
4.0±0.1
1.75±0.1
1.5
+0.1
0
W
+0.3
−0.1
A0
K0
B0
T
Ø
W1
W2
Chip Size (EIA)
Horizontal
Mounting
Dimensions in mm Taping Specication
W H L W P
1
A
0
B
0
K
0
D W
1
W
2
Nominal
Nominal
Nominal
−0.1/+0.3
+/−0.1
Nominal
Nominal
Nominal
−/+2.0
−0/+2
Maximum
1206
1.7
All
3.3
8
4
2
3.8
1.3
180
8
12
1210
2.5
All
3.3
8
4
3
3.8
2.1
180
8
12
1812
3.3
≤ 1.9
4.7
12
8
3.8
5.3
2
330
12
16
1812
3.3
2.1 – 2.6
4.7
12
8
3.9
5.2
2.6
330
12
16
In accordance with IEC 60286–3
Materials:
- carrier tape: antistatic material
- cover tape: polyester + polythene
- reel: recyclable polystyrene
All parts in reels are packed in hermetically sealed Moisture Barrier Bag (MBB) Class 1.