Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 7
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Soldering Process
Reow Recommendations
Preheating
Maximum Preheating Time 180 seconds
Minimum Temperature 150°C
Maximum Temperature 200°C
Maximum Time within T
max
and
T
max
– 5°C (∆T
5
)
30 seconds (T
max
≤ 250°C)
10 seconds
(250 °C < T
max
≤ 260°C)
Maximum Time Over 217°C
(∆T
217
)
150 seconds
Maximum Temperature Ramp
Rate
3°C/seconds (heating)
6°C/seconds (cooling)
Second reow
If two reow processes are needed, be sure that before the second
reow, the temperature on the capacitor’s surface is lower than 50°C.
* Maximum Temperature on the component's body (T
max
): = 260 °C.
Flux/Cleaning/Storage and Moisture
Flux suggestions
KEMET suggests to use a no-clean ux with a halogen content lower than 0.1%.
Cleaning suggestions
To clean the PCB assembly KEMET recommends to use a suitable solvent like Isopropyl alcohol, deionized water or neutral
pH detergents. Aggressive solvents shall not be used. For any different cleaning solvent used please contact KEMET
Technical Services to analyze the potential impact on KEMET products.
Storage and moisture recommendations
KEMET SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1. We can guarantee a 24 months shelf life
(temperature ≤ 40°C/relative humidity ≤ 90%). After the MBB has been opened, components may stay in areas with controlled
temperature and humidity (temperature ≤ 30°C/relative humidity ≤ 60%) for 168 hours [MSL 3]. For longer periods of time
and/or higher temperature and/or higher relative humidity values, it is absolutely necessary to protect the components
against humidity. If the reel inside the MBB is partially used, KEMET recommends to re-use the same MBB or to avoid areas
without controlled temperature and humidity (see above). If the above conditions are not respected, components require a
baking (minimum time: 48 hours at 55±5°C) before the reow.
Preheating
Reflow Temperature Profile
Time
Temperature
Linear profiles are also allowed (if in line with the reflow recommendations)
∆T
217
∆T
5
217°C
T
max
−5°C
T
max