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ManualsBrandsKEMET ManualsCapacitorsSMD Metallized PPS Film Capacitor, 100nF, AC, 50VDC, 5%
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 9
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Packaging Quantities
Chip Size (EIA) Height (mm) Reel
1206
1.1
3,000
1206
1.2
3,000
1206
1.3
3,000
1210
1.4
2,250
1210
1.5
2,250
1210
1.7
2,250
1210
1.9
2,250
1210
2.0
2,250
1210
2.3
2,250
1812
1.7
4,000
1812
2.0
3,000
Landing
A
B C
D
Size
Dimensions in mm
A B C D
1206
1.5
1.1
2.3
4.5
1210
2.3
1.1
2.3
4.5
1812
3
1.7
3.1
6.5
These landing area dimensions have the aim of taking full advantage of the new RoHS 6 terminations design.
We suggest to use a Sn/Ag/Cu solder paste (suggested thickness: 0.10 – 0.15 mm).
If a NOT Lead Free solder paste is used, a minimum peak temperature of 210°C on the component’s body is suggested.