Datasheet

17© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F3078_LDE • 2/19/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Polyethylene Naphthalate (PEN) Film Capacitor
LDE, Unencapsulated Stacked Chip, Size 1206 – 6054, 50 – 1,000 VDC (Automotive Grade)
Packaging Quantities
Chip Size (EIA) Height (mm) Reel
1206
All
3,000
1210
All
2,250
1812
≤1.9
4,000
1812
2.1 – 2.6
3,000
2220
≤2.8
3,000
2220
2.9 – 3.7
2,250
2220
3.8 – 4.4
1,750
2824
2.6 – 3.6
2,250
2824
3.8 – 4.4
1,750
2824
4.7 – 5.4
1,500
4030
2.7 – 3.7
1,500
4030
3.9 – 4.5
1,250
4030
4.7 – 5.6
1,000
5040
3.1 – 3.5
1,500
5040
3.8 – 4.4
1,250
5040
4.7 – 5.7
1,000
6054
3.3 – 4.2
1,000
6054
4.5 – 4.9
750
6054
5.3 – 5.7
750
Landing
Size
Dimensions in mm
A B C D
1206
1.5
1.1
2.3
4.5
1210
2.3
1.1
2.3
4.5
1812
3.0
1.7
3.1
6.5
2220
4.6
2.1
3.9
8.1
2824
5.7
2.3
5.3
9.9
4030
7.4
2.6
8.2
13.4
5040
9.6
2.6
10.7
15.9
6054
12.6
2.6
13.2
18.4
These landing area dimensions have been developed to take full advantage of the new RoHS 6 terminations design.
We suggest to use a Sn/Ag/Cu solder paste (suggested thickness: 0.10 – 0.15 mm).
If a non-lead free solder paste is used, a minimum peak temperature of 210°C on the component’s body is suggested.
A
B C
D