Datasheet

11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F3087_P278_X1_480 • 2/20/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Film Capacitors – AC Line EMI Suppression and RC Networks
P278, Metallized Impregnated Paper, Class X1, 480 VAC
Lead Taping & Packaging (IEC 60286–2)
Taping Speci cation
Dimensions in mm
Standard IEC
60286-2
Lead Spacing +6/−0.1 F 5 7.5 Formed 7.5 10 15 22.5 27.5 F
CarrierTapeWidth ±0.5 W 18 18 18 18 18 18 18 18+1/−0.5
Hold-downTapeWidth Minimum W
0
5 5 5 5 5 5 5
Position of Sprocket Hole ±0.5 W
1
9 9 9 9 9 9 9 9+0.75/−0.5
Distance Between Tapes Maximum W
2
3 3 3 3 3 3 3 3
Sprocket Hole Diameter ±0.2 D
0
4 4 4 4 4 4 4 4
Feed Hole Lead Spacing ±0.3 P
0
(1) 12.7 12.7 12.7 (4) 12.7 12.7 12.7 12.7 12.7
Distance Lead – Feed Hole ±0.7 P
1
3.85 3.75 3.75 7.7 5.2 5.3 5.3 P1
Deviation Tape – Plane Maximum ∆p 1.3 1.3 1.3 1.3 1.3 1.3 1.3 1.3
Lateral Deviation Maximum ∆h 2 2 2 2 2 2 2 2
Total Thickness ±0.2 t 0.7 0.7 0.7 0.7 0.7
0.9
maximum
0.9
maximum
0.9
maximum
Sprocket Hole/Cap Body Nominal H
0
(2) 18.5±0.5 18.5±0.5 18.5±0.5 18.5±0.5 18.5±0.5 18.5±0.5 18.5±0.5 18.0+2/−0
Sprocket Hole/
Top of Cap Body
Maximum H
1
(3) 32 31 43 43 43 58 58 58 maximum
(1) Maximum cumulative feed hole error, 1 mm per 20 parts
(2) 16.5 mm available on request
(3) Depending on case size
(4) 15 mm available on request
Lead Spacing 5 mm
Lead Spacing 7.5 mm
Lead Spacing 10 – 15mm
Lead Spacing 22.5 – 27.5 mm
Formed Leads from 10 and 15 mm to 7.5 mm
0
0
0
0
0