Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3089_P409_X2_275 • 10/31/2017 10
Film Capacitors – AC Line EMI Suppression and RC Networks
P409 Series Metallized Impregnated Paper, Class X2, 275 VAC
Lead Taping & Packaging (IEC 60286–2)
Taping Speci cation
Dimensions in mm Standard IEC 60286–2
Lead spacing +6/−0.1 F
Formed
7.5
10.2 15.2 20.3 22.5 F
Carrier tape width +/−0.5 W 18 18 18 18 18 18
+1/−0.5
Hold-down tape width +/−0.3 W
0
9 12 12 12 12
Position of sprocket hole +/−0.5 W
1
9 9 9 9 9 9
+0.75/−0.5
Distance between tapes Maximum W
2
3 3 3 3 3 3
Sprocket hole diameter +/−0.2 D
0
4 4 4 4 4 4
Feed hole lead spacing +/−0.3 P
0
(1)
12.7
(4)
12.7 12.7 12.7 12.7 12.7
Distance lead – feed hole +/−0.7 P
1
3.75 7.6 5.1 8.9 5.3 P
1
Deviation tape – plane Maximum ∆p 1.3 1.3 1.3 1.3 1.3 1.3
Lateral deviation Maximum ∆h 2 2 2 2 2 2
Total thickness +/−0.2 t 0.7 0.7 0.7 0.7 0.9
MAX
0.9
MAX
Sprocket hole/cap body Nominal H
0
(2)
18
+2/−0
18
+2/−0
18
+2/−0
18
+2/−0
18.5
+/−0.5
18
+2/−0
Sprocket hole/top of cap body Maximum H
1
(3)
35 35 35 35 58 58
MAX
(1) Maximum cumulative feed hole error, 1 mm per 20 parts.
(2) 16.5 mm available on request.
(3) Depending on case size.
(4) 15 mm available on request.
Lead Spacing 10.2 – 15.2 mm
Lead Spacing 20.3 – 22.5 mm
Formed Leads from 10.2 to 7.5 mm
H
1
H
0
H
0
P
0
P
1
D
0
W
2
W
0
W
1
H
1
P
0
W
2
W
0
D
0
W
t
W
1
H
1
H
0
P
0
D
0
W
2
W
1
W
0
D
0
P
1
∆p ∆p ∆p
∆p ∆p
∆p
∆h ∆h
W
∆h∆h
t
∆h ∆h
F
F
F = 7.5
W
W
P
1