Datasheet

10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F3014_PME271E_X1_300 • 3/15/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Film Capacitors – AC Line EMI Suppression and RC Networks
PME271E Series Metallized Impregnated Paper, Class X1, 300 VAC
Lead Taping & Packaging (IEC 60286–2)
Taping Speci cation
Dimensions in mm
Standard IEC
60286–2
Lead Spacing +6/−0.1 F Formed 7.5 10.2 15.2 20.3 22.5 F
Carrier Tape Width ±0.5 W 18.0 18.0 18.0 18.0 18.0 18+1/−0.5
Hold-Down Tape Width Minimum W
0
5.0 5.0 5.0 5.0 5.0
Position of Sprocket Hole ±0.5 W
1
9.0 9.0 9.0 9.0 9.0 9+0.75/−0.5
Distance Between Tapes Maximum W
2
3.0 3.0 3.0 3.0 3.0 3.0
Sprocket Hole Diameter ±0.2 D
0
4.0 4.0 4.0 4.0 4.0 4.0
Feed Hole Lead Spacing ±0.3 P
0
(1)
12.7
(4)
12.7 12.7 12.7 12.7 12.7
Distance Lead – Feed Hole ±0.7 P
1
3.75 7.6 5.1 8.9 5.3 P
1
Deviation Tape – Plane Maximum ∆p 1.3 1.3 1.3 1.3 1.3 1.3
Lateral Deviation Maximum ∆h 2.0 2.0 2.0 2.0 2.0 2.0
Total Thickness ±0.2 t 0.7 0.7 0.7 0.7 0.9 Maximum 0.9 Maximum
Sprocket Hole/Cap Body Nominal H
0
(2)
18+2/−0 18+2/−0 18+2/−0 18+2/−0 18.5 ±0.5 18+2/−0
Sprocket Hole/Top of Cap Body Maximum H
1
(3)
43 43 43 58 58 58 Maximum
(1) Maximum cumulative feed hole error, 1 mm per 20 parts
(2) 16.5 mm available on request
(3) Depending on case size
(4) 15 mm available on request
Lead Spacing 10.2 – 15.2 mm
Lead Spacing 20.3 – 22.5 mm
Formed Leads from 10.2 – 7.5 mm
H
1
H
0
H
0
P
0
P
1
D
0
W
2
W
0
W
1
H
1
P
0
W
2
W
0
D
0
W
t
W
1
H
1
H
0
P
0
D
0
W
2
W
1
W
0
D
0
P
1
∆p ∆p ∆p
∆p ∆p
∆p
∆h ∆h
W
∆h∆h
t
∆h ∆h
F
F
F = 7.5
W
W
P
1