Datasheet

8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F3017_PME271YA_Y2_300 • 3/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Film Capacitors – AC Line EMI Suppression and RC Networks
PME271YA–E, Metallized Impregnated Paper, Class Y2, 300 VAC
Soldering Process cont'd
Wave Soldering Recommendations cont'd
1.Thetableindicatesthemaximumsetuptemperatureforthesolderingprocess.
Dielectric
lm
material
Maximum Preheat Temperature
Maximum Peak Soldering
Temperature
Capacitor
Pitch≤10mm
Capacitor
Pitch = 15 mm
Capacitor
Pitch > 15 mm
Capacitor
Pitch≤15mm
Capacitor
Pitch > 15 mm
Polyester 130°C 130°C 130°C 270°C 270°C
Polypropylene 100°C 110°C 130°C 260°C 270°C
Paper 130°C 130°C 140°C 270°C 270°C
Polyphenylene
Sulphide
150°C 150°C 160°C 270°C 270°C
2. The maximum temperature measured inside the capacitor: set the temperature so that inside the element the maximum
temperatureisbelowthelimit.
Dielectric Film Material
Maximum Temperature
Measured Inside the Element
Polyester 160°C
Polypropylene 110°C
Paper 160°C
Polyphenylene Sulphide
160°C
Temperature monitored inside the capacitor.
Selective Soldering Recommendations
Selectivedipsolderingisavariationofreowsoldering.Inthismethod,theprintedcircuitboardwiththrough-hole
componentstobesolderedispreheatedandtransportedoverthesolderbath,asinnormalowsoldering,without
touchingthesolder.Whentheboardisoverthebath,itisstopped.Pre-designedsolderpotsareliftedfromthebath
withmoltensolder,onlyattheplacesoftheselectedcomponents,andpressedagainstthelowersurfaceoftheboard
to solder the components.
Thetemperatureproleforselectivesolderingissimilartothedoublewaveowsolderingoutlinedinthisdocument.
However, instead of two baths, there is only one with a time from 3 to 10 seconds. In selective soldering, the risk of
overheatingisgreaterthanindoublewaveowsoldering.Greatcaremustbetakensothatthepartsdonotoverheat.