Datasheet
6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F3064_PME295_Y1_440-480 • 3/15/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Film Capacitors
AC Line EMI Suppression and RC Networks – PME295, Metallized Impregnated Paper, Class Y1, 440 VAC/480 VAC
Manual Soldering Recommendations
Following is the recommendation for manual
soldering with a soldering iron.
The soldering iron tip temperature should
besetat350°C(+10°Cmaximum)withthe
soldering duration not to exceed more than 3
seconds.
Recommended Soldering Temperature
0
50
100
150
200
250
300
350
400
0 1 2 3 4 5 6 7 8
Soldering Time (seconds)
Soldering Iron Bit Temperature (°C)
Soldering Process
The implementation of the RoHS directive has resulted in the selection of SnAuCu (SAC) alloys or SnCu alloys as primary
solder.Thishasincreasedtheliquidustemperaturefrom183°CforSnPbeutecticalloysto217–221°Cforthenewalloys.
As a result, the heat stress to the components, even in wave soldering, has increased considerably due to higher preheat and
wave temperatures. Polypropylene capacitors are especially sensitive to heat (the melting point of polypropylene is 160 –
170°C).Wavesolderingcanbedestructive,especiallyformechanicallysmallpolypropylenecapacitors(withleadspacingof
5to15mm),andgreatcaremustbetakenduringsoldering.TherecommendedsolderprolesfromKEMETshouldbeused.
Consult KEMET with any questions. In general, the wave soldering curve from IEC Publication 61760-1, Edition 2 serves as a
solid guideline for successful soldering. See Figure 1.
Reowsolderingisnotrecommendedforthrough-holelmcapacitors.Exposingcapacitorstoasolderingproleinexcess
of the above the recommended limits may result in degradation of or permanent damage to the capacitors.
Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components.
Insertthrough-holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprolein
the oven, if through-hole components must pass through the adhesive curing process. A maximum of two soldering cycles is
recommended. Allow time for the capacitor surface temperature to return to normal before the second soldering cycle.
Wave Soldering Recommendations
0
50
100
150
200
250
300
0
40
80
120
160
200
240
Temperature (°C)
Time (s)
ca 2°C/second
ca 3.5°C/second typical
ca 5°C/second
Cooling
2 +3 seconds maximum
115 °C max
T
preheat
∆T < 150°C
100 °C
Preheating
Typical
First wave
Second wave
260°C