Datasheet

12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F3083_SMC • 3/18/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Metallized PPS Film Capacitor
SMC, Encapsulated, Size 2220 – 6560, 50 – 400 VDC
Landing
Mounting Chip Size
Dimensions in mm
A B X
Horizontal
2220
5.1
1.5
3.0
2824
6.1
1.5
3.8
4036
9.1
2.0
5.5
5045
11.6
2.5
7.0
6560
15.0
3.0
9.0
Vertical
4022
5.6
2.0
5.5
5026
6.6
2.5
7.0
6528
7.1
3.0
9.0
Carrier Taping & Packaging (IEC 60286–2)
Horizontal Taping Orientation
4.0 ±0.1
P
1
A
0
K
0
Direction of Unreeling
Ø1.5
+0.1
−0
2.0 ±0.05
1.75 ±0.1
W
Chip Size (EIA)
Horizontal
Mounting
Dimensions in mm Taping Specication
B H L W P
1
A
0
B
0
K
0
D W
1
W
2
Nominal
Nominal
Nominal
−0/+0.3
±0.1
Nominal
Nominal
Nominal
±2.0
−0/+2
Maximum
2220
5.0
3.0
5.7
12.0
8.0
5.5
6.0
3.3
330
12.4
22.0
2220
5.0
4.0
5.7
12.0
8.0
5.5
6.0
4.3
330
12.4
22.0
2824
6.0
3.0
7.3
12.0
8.0
6.5
7.5
3.3
330
12.4
22.0
2824
6.0
3.5
7.3
12.0
8.0
6.5
7.5
3.8
330
12.4
22.0
2824
6.0
4.5
7.3
16.0
8.0
6.6
7.9
5.5
330
16.0
20.0
4036
9.1
5.5
10.2
16.0
16.0
9.5
10.5
5.8
330
16.4
22.0
5045
11.5
6.5
12.7
24.0
16.0
11.9
13.1
6.8
330
24.4
30.0
6560
15.0
7.0
16.5
24.0
20.0
15.4
16.8
7.3
330
24.4
30.0
B
X
X
A