Datasheet

9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2004_T490 • 8/20/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
9
Tantalum Surface Mount Capacitors – Standard Tantalum
T490 Commercial Grade MnO
2
Soldering Process
KEMET’sfamiliesofsurfacemountcapacitorsarecompatible
with wave (single or dual), convection, IR, or vapor phase
reowtechniques.Preheatingofthesecomponentsis
recommended to avoid extreme thermal stress. KEMET's
recommendedproleconditionsforconvectionandIR
reowreecttheproleconditionsoftheIPC/J–STD–020D
standard for moisture sensitivity testing. The devices can
safelywithstandamaximumofthreereowpassesatthese
conditions.
PleasenotethatalthoughtheX/7343–43casesizecan
withstandwavesoldering,thetallprole(4.3mmmaximum)
dictates care in wave process development.
Hand soldering should be performed with care due to the
dicultyinprocesscontrol.Ifperformed,careshouldbe
taken to avoid contact of the soldering iron to the molded
case. The iron should be used to heat the solder pad, applying
solderbetweenthepadandthetermination,untilreow
occurs.Oncereowoccurs,theironshouldberemoved
immediately. “Wiping” the edges of a chip and heating the top
surface is not recommended.
Duringtypicalreowoperations,aslightdarkeningofthe
gold-colored epoxy may be observed. This slight darkening is
normal and not harmful to the product. Marking permanency
is not affected by this change.
Prole Feature SnPb Assembly
Pb-Free Assembly
Preheat/Soak
Temperature Minimum (T
Smin
) 100°C 150°C
Temperature Maximum (T
Smax
) 150°C 200°C
Time (t
s
) from T
smin
to T
smax
) 60 – 120 seconds 60 – 120 seconds
Ramp-up Rate (T
L
to T
P
) 3°C/second maximum 3°C/second maximum
Liquidous Temperature (T
L
) 183°C 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (T
P
)
220°C*
235°C**
250°C*
260°C**
Time within 5°C of Maximum
Peak Temperature (t
P
)
20 seconds maximum 30 seconds maximum
Ramp-down Rate (T
P
to T
L
) 6°C/second maximum 6°C/second maximum
Time 25°C to Peak
Temperature
6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reow.
* For Case Size height > 2.5 mm
** For Case Size height ≤ 2.5 mm
Storage
Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storagehumiditynotexceed60%relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationon
thepartsandatmospheresshouldbefreeofchlorineandsulphurbearingcompounds.Foroptimizedsolderabilitychipstock
should be used promptly, preferably within three years of receipt.
Time
Temperature
T
smin
25
T
smax
T
L
T
P
Maximum Ramp Up Rate = 3°C/second
Maximum Ramp Down Rate = 6°C/second
t
P
t
L
t
s
25°C to Peak