Datasheet
Keratherm
®
Bond 100 RT
Keratherm Thermal Adhesive
Applications
CPU
LED
BGA
heat sinks
Benefits
high bond strength
room temerature curing
thixothropic and filling
surface structures
Data for engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
*Shear rate 4s
-1
/ 25°C
Properties Unit 100 RT
Colour brown
Mixing ratio 1 : 1
Curing T [°C] 20 min RT
Thermal conductivity λ * W/mK 1.5
Thermal resistance Rth * K/W 0.83
Measured thickness mm 0.5
Hardness Shore A 20 - 35
Tensile sheer strength MPa >15
Dielectric breakdown kV/mm 12
Density g/cm³ 2.1
Viscosity Pas 20 - 40
Application temperature °C -40 - 180
Packing units:
syringe: 5 ml
double cartusche: 50 ml
can: 1.0 kg Special packing on request!
Processing Instructions:
All surfaces should be even and free
from oil, grease or dust. Clean sur-
face with a solvent (e.g. acetone,
thinner, etc.).
Screw emulsion tube onto the cartridge.
Squeeze adhesive out of the emul-
sion tube (in a strand of ca. 3 cm),
until the adhesive emitted is of con-
sistent light brown color. Adhesive
that is not of consistent color will not
bind and is thus to be disposed of.
Evenly spread the adhesive on one
of the surfaces to be bonded.
Bond the components.
Briey press the components onto
each other and avoid moving them
for the next 30 minutes. If bonded at
an angle or overhead, please secure
the components.
The initial hardness is achieved after
15 minutes, nal hardness is achieved
after 4 hours.
Safety information:
Classification as per Regulation
(EC) 1272/2008 (CLP): none
Thermal Adhesive
www.kerafol.com