Datasheet

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DESCRIPTION

HyperX HX318LS10IB/4 is a 512M x 64-bit (4GB) DDR3L-1866

CL10 SDRAM (Synchronous DRAM) 1Rx8, low voltage, memory

modules, based on eight 512M x 8-bit DDR3 FBGA compo-

nents. This module has been tested to run at DDR3L-1866 at a

low latency timing of 10-10-10 at 1.35V or 1.5V. Additional

timing parameters are shown in the PnP Timing Parameters

section below. The JEDEC standard electrical and mechanical

specifications are as follows:

Document No. 4807214-001.A00 01/07/15 Page 1

SPECIFICATIONS

selcyc 01)DDI(LC

Row Cycle Time (tRCmin) 44.7ns (min.)

Refresh to Active/Refresh 260ns (min.)

Command Time (tRFCmin)

Row Active Time (tRASmin) 34ns (min.)

Maximum Operating Power TBD W* @1.35V

0 - V 49gnitaR LU

Operating Temperature 0

C to 85

Storage Temperature -55

C to +100

*Power will vary depending on the SDRAM used.

HX318LS10IB/4

4GB 512M x 64-Bit DDR3L-1866

CL10 204-Pin SODIMM

Continued >>

kingston.com/hyperx

PnP JEDEC TIMING PARAMETERS:

• DDR3-1866 CL10-10-10 @1.35V or 1.5V

• DDR3-1600 CL9-9-9 @1.35V or 1.5V

• DDR3-1333 CL8-8-8 @1.35V or 1.5V

Note: The PnP feature offers a range of speed and timing options to support

the widest variety of processors and chipsets. Your maximum speed will

be determined by your BIOS.

FEATURES

• JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~

1.575V) Power Supply

• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)

• 933MHz fCK for 1866Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6, 5

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not

allow seamless read or write [either on the fly using A12 or

MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ

pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE

< 95°C

• Asynchronous Reset

• PCB : Height 1.180” (30.00mm), double sided component

Summary of content (2 pages)

PAGE 1
HX318LS10IB/4 4GB 512M x 64-Bit DDR3L-1866 CL10 204-Pin SODIMM SPECIFICATIONS CL(IDD) 10 cycles Row Cycle Time (tRCmin) 44.7ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 260ns (min.) Row Active Time (tRASmin) 34ns (min.) Maximum Operating Power TBD W* @1.35V UL Rating 94 V - 0 Operating Temperature 0o C to 85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used.
PAGE 2
continued HyperX MODULE DIMENSIONS FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. kingston.com/hyperx Document No.