Datasheet

DESCRIPTION
SPECIFICATIONS
*Power will vary depending on the SDRAM used.
HX430C15SB2K4/32
32GB (8GB 1G x 64-Bit x 4 pcs.)
DDR4-3000 CL15 288-Pin DIMM Kit
Continued >>
FEATURES
HyperX HX430C15SB2K4/32 is a kit of four 1G x 64-bit (8GB)
DDR4-3000 CL15 SDRAM (Synchronous DRAM) 2Rx8, memory
modules, based on sixteen 512M x 8-bit FBGA components per
module. Total kit capacity is 32GB. Each module supports
Intel® XMP (Extreme Memory Profiles). Each module has
been tested to run at DDR4-3000 at a low latency timing of
15-17-17 at 1.35V. The SPDs are programmed to JEDEC
standard latency DDR4-2133 timing of 15-15-15 at 1.2V.
Each 288-pin DIMM uses gold contact fingers. The JEDEC
standard electrical and mechanical specifications are as
follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
15 cycles
46.5ns (min.)
260ns (min.)
33ns (min.)
TBD W*
94 V - 0
0
o
C to +85
o
C
-55
o
C to +100
o
C
XMP TIMING PARAMETERS
•
JEDEC: DDR4-2133 CL15-15-15 @1.2V
•XMP Profile #1: DDR4-3000 CL15-17-17 @1.35V
•XMP Profile #2: DDR4-2666 CL14-15-15 @1.35V
Document No. 4807559-001.A00 12/22/15 Page 1
hyperxgaming.com
HX430C15SB2K4/32
3
2
G
B
(
8
G
B 1
G
x 64-Bit x 4
p
cs.
)
Memory Module Specifications
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.25V to 3.6V
• On-Die termination (ODT)
• 16 internal banks; 4 groups of 4 banks each
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Height 1.36” (34.57mm)