User's Manual

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Chapter 1 Overview
The Integral Wafer User Manual is designed to document the setup and use of the Integral
Wafer system in conjunction with the Integral Wafer Controller software. This manual will
discuss only the non-contact version of the Integral Wafer. The results of the measurement
run may be analyzed using the Thermal MAP Analysis Software included with the system.
The Thermal MAP Analysis software program is documented in the Thermal MAP Analysis
Software User Manual. A PDF version of this manual may be found in the C:\Sensarray\
Documents folder on your computer’s hard drive.
This chapter discusses the features of the non-contact Integral Wafer system.
The Integral Wafer System
The Integral Wafer has a complete measurement system embedded in the wafer to record
thermal surveys in semiconductor processing equipment without the need for wired
connections. Embedding the components within the wafer allows it to be treated like a
production wafer in most equipment, as long as it is within the operating temperature range
of the wafer.
The Integral Wafer system consists of an Integral Wafer, a carrier station for communicating
with and recharging the wafer, a USB cable, a laptop computer, and a CD containing the
software and drivers needed by the system.
The Integral Wafer system is delivered with a SensArray-provided laptop computer pre-
loaded with all software. As an option, existing Thermal MAP laptop computer systems
may be upgraded to run the Integral Wafer software as long as you are running Windows
2000 or higher, and have an available USB port.
Integral Wafer systems are available in 200 mm and 300 mm versions, with different carrier
station options. The systems can acquire data from 1 to 64 analog channels, depending on
the model. The analog channels are divided into banks. Each bank is made up of up to 8
wafer sensors.
Measurements taken by the sensors are converted from analog to digital signals within the
onboard electronics.
Acquiring Data
Utilizing the Integral Wafer to acquire temperature data in your equipment is a simple
process. Measurement parameters, such as sensors to be used, scan rate, time delay, etc., are
set up using the Controller software. The wafer is then transferred to the measurement
chamber from a FOUP or cassette via robotic arms, and the thermal measurement survey
data is acquired. After the survey is complete, the wafer is returned to the Carrier station
and the data can be retrieved from the onboard memory. The data may then be analyzed
using Thermal MAP Analysis Software.
Non-contact Integral Wafer User Manual