Data Sheet IO-Link Wireless Device Module KE2640MODA1 DO0402R01 • 4/20/2021
KUNBUS GmbH Table of Contents Table of Contents 1 Disclaimer .................................................................................................................................................... 3 2 Overview....................................................................................................................................................... 4 2.1 Features......................................................................................................................
Disclaimer 1 Disclaimer © 2021 KUNBUS GmbH, Denkendorf (Germany) The contents of this document have been prepared by KUNBUS GmbH with the utmost care. Due to technical developments, KUNBUS GmbH reserves the right to change or replace the contents of this document without prior notice. You can always obtain the latest version of the user manual at our homepage: www.kunbus.de KUNBUS GmbH shall be liable exclusively to the extent specified in the General Terms and Conditions (www.kunbus.de/agb.html).
Overview 2 Overview KE2640MODA1 is an IO-Link Wireless system on module (SOM) that supports physical layer, data link layer and all upper layer services of the IO-Link Wireless Device as specified in the IO-Link Wireless System Extensions v1.1. The module can either be used as SOM providing the entire IOLink Wireless Device solution on module or as communication controller for a host processor.
Certification 3 Certification The KE2640MODA1 module is certified to the standards listed in the following table (with IDs where applicable). Certification Body FCC (USA) IC (Canada) EN (Europe) Specification Title 47 CFR Part 15 + MPE RSS - 247 Issue 2 + RSS-102 Issue 5 (MPE) ETSI EN 300 328 V2.2.2 ID 2AYYK-2640M1 26994-2640M1 n/a 3.
Certification – The module integrator should not provide information to the user of the host product regarding how to install or remove this RF module. The user manual for the host product must clearly indicate the operating conditions for the product to ensure compliance with the FCC RF exposure guidelines. – If this module is integrated in host products with several transmitters, the host product must be evaluated to comply with FCC and Industry Canada multi-transmitter product procedures.
Certification Label and Compliance Information The host product using this module must be labeled clearly indicating the contained FCC-ID and IC. These or similar labels must be used: “Contains FCC ID: 2AYYK-2640M1 ” “Contains IC: 26994-2640M1”. Test Modes The module supports different test modes on specified test channels. These test modes can be activated via the host controller software library, which is required for the module operation.
Key Specification 4 Key Specification The absolute maximum ratings are as follows: Parameter Supply voltage Input RF level Operating temperature range VESD - Human Body Model (HBM), per ANSI/ ESDA/JEDEC/JS0011 VESD - Charged Device Model (CDM), per JESd22-C1012 Nominal Data Min 0V -40 °C -2500 V Nominal Data Max 4V 4 dBm +85 °C 2500 V Note -750 V 750 V RF pins -750 V 750 V Non-RF pins All pins 1 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control pr
Key Specification Safety Note This product may only be assembled, installed and put into operation by personnel qualified for working in electrostatic protected areas. It is subject to damage by ESD and may only be handled in ESD-protected environments.
Block Diagram 5 Block Diagram If the KE2640MODA1 module is used with the pre-installed firmware, the following block diagram applies. It outlines the rules for the connection of the KE2640MODA1 module to the host controller.
Typical Application Circuit 6 Typical Application Circuit Set-up including Host CPU Stand-alone Set-up IO-Link Wireless Device Module 11
Pin Assignment 7 Pin Assignment The following table gives an overview of all pin functions: Pin Name Function Function 1 DIO_0 using pre-installed firmware DEVICE_REQ (Input) 2 DIO_1 DEVICE_RDY (Output) 3 DIO_2 SPI_CS (Input) 4 5 6 7 JTAG_TMS GND JTAG_TCK DIO_3/JTAG_TDO1 Debugging port Ground Debugging port Debugging port 8 DIO_4/JTAG_TDI1 Debugging port 9 10 11 12 13 VCC GND RESET DIO_7 DIO_6 Voltage supply Ground nRESET (Input active LOW) SPI_MOSI (Input) SPI_MISO (Output) 14 DIO_5
Firmware 8 Firmware The pre-installed firmware is designed for using the KE2640MODA1 module in combination with an external host controller for the user's application. Although the KE2640MODA1 module can also be used as system on module (SOM) where the user implements the application directly on the KE2640MODA1 module, the following subchapters describe only the function of the preinstalled firmware. 8.
Firmware After the pins are configured, the IO-Link Wireless Module nRESET pin should be set to LOW to perform a reset of the KE2640MODA1 module. This is an important step as it is required for the synchronization of the state machines of both controllers. After the KE2640MODA1 module is set to the reset state, the SPI periphery should be initialized with the following parameters at the host controller.
Firmware The DEVICE_RDY pin will be set to LOW by the KE2640MODA1 when it starts to process the message (T4). Then the host may set the next DEVICE_REQ and wait again for the DEVICE_RDY signal. In the case data has to be transmitted by the KE2640MODA1 module and no DEVICE_REQ is coming from the host, the KE2640MODA1 module will set the DEVICE_RDY pin to HIGH. Then the host shall initiate SPI communication as soon as possible even if no DEVICE_REQ is pending.
Antenna Gain Setting 9 Antenna Gain Setting This module supports the setting of the gain of the connected antenna. The setting mechanism is accessible via the host controller software library, that is required for module operation. The gain setting mechanism reduces the maximum module output power of 10 dBm by the amount of the selected antenna gain in 1 dB steps. For the certification of the module with its reference antennas, the following antenna gain settings were used: Antenna U.
Layout Guidelines 10 Layout Guidelines KE2640MODA1 Module 10.1 PCB Specification PCB Stack-Up The following figure shows an example stack-up for a KE2640MODA1 design. The user can adapt the layer stack-up according to his own requirements. In this case the correct impedance of 50 Ω has to be ensured. Ideally this is done in cooperation with the selected PCB manufacturer. With this example stack-up, the width of a 50 Ω track is about 448 µm.
Layout Guidelines 10.2 Layout An example layout is shown in the following by means of a KUNBUS breakout board. Layer 1 - Top Layer 448µm GND plane (whole grey area) no copper in this area On this layer the module is connected to its periphery. The unused areas are filled with copper that is connected to GND potential. The GND pins of the module are connected directly to this GND plane to receive best possible GND connection with low impedance.
Layout Guidelines Layer 3 – Signal GND plane 3.3 V plane This layer is used for supply planes (3.3V and GND).
Layout Guidelines Layer 4 - Bottom Layer GND plane This layer is used for routing signals. Unused areas are filled with GND plane.
Footprint Indications 11 Footprint Indications 11.
Footprint Indications 11.2 Dimensions The outline dimensions of the module are as shown below. Top View Side View Suggested Land Pattern, all dimensions in mm.
Contact Details 12 Contact Details Your points of contact for all questions related to development, delivery, support and quotations are: Address KUNBUS GmbH Heerweg 15C 73770 Denkendorf Technical Support Sales Germany E-Mail: support@kunbus.com Tel.: +49 (0)711 300 20 678 E-Mail: info@kunbus.com For any request, please use the following reference: Article Name: IOLW Device Module Order No.
