Data Sheet IO-Link Wireless Master Module KE2640MODA2 DO0401R01 • 4/22/2021
KUNBUS GmbH Table of Contents Table of Contents 1 Disclaimer .................................................................................................................................................... 3 2 Overview....................................................................................................................................................... 4 2.1 Features......................................................................................................................
Disclaimer 1 Disclaimer © 2021 KUNBUS GmbH, Denkendorf (Germany) The contents of this document have been prepared by KUNBUS GmbH with the utmost care. Due to technical developments, KUNBUS GmbH reserves the right to change or replace the contents of this document without prior notice. You can always obtain the latest version of the user manual at our homepage: www.kunbus.de KUNBUS GmbH shall be liable exclusively to the extent specified in the General Terms and Conditions (www.kunbus.de/agb.html).
Overview 2 Overview KE2640MODA2 is an IO-Link Wireless transceiver module that supports physical layer and data link layer services of the IO-Link Wireless Master as specified in the IO-Link Wireless System Extensions v1.1. The module is capable to serve up to 8 IO-Link Wireless-Devices as one track with a cycle time of 1.664ms.
Certification 3 Certification The KE2640MODA2 module is certified to the standards listed in the following table (with IDs where applicable). Certification Body FCC (USA) IC (Canada) EN (Europe) Specification Title 47 CFR Part 15 + MPE RSS - 247 Issue 2 + RSS-102 Issue 5 (MPE) ETSI EN 300 328 V2.2.2 ID 2AYYK-2640M2 26994-2640M2 n/a 3.
Certification – The module integrator should not provide information to the user of the host product regarding how to install or remove this RF module. The user manual for the host product must clearly indicate the operating conditions for the product to ensure compliance with the FCC RF exposure guidelines. – If this module is integrated in host products with several transmitters, the host product must be evaluated to comply with FCC and Industry Canada multi-transmitter product procedures.
Certification Label and Compliance Information The host product using this module must be labeled clearly indicating the contained FCC-ID and IC. These or similar labels must be used: “Contains FCC ID: 2AYYK-2640M2 ” “Contains IC: 26994-2640M2”. Test Modes The module supports different test modes on specified test channels. These test modes can be activated via the host controller software library, which is required for the module operation.
Key Specification 4 Key Specification The absolute maximum ratings are as follows: Parameter Supply voltage Input RF level Operating temperature range VESD - Human Body Model (HBM), per ANSI/ ESDA/JEDEC/JS0011 VESD - Charged Device Model (CDM), per JESd22-C1012 Nominal Data Min 0V -30 °C -2000 V Nominal Data Note Max 3.
Block Diagram 5 Block Diagram The block diagram outlines the main functional blocks, their interconnections as well as the external connections. Two RF transceivers of the type CC2640 from Texas Instruments are integrated in this module. It is specified here that only one of the transceivers is used for transmit mode. The second transceiver is only used to support the receive mode of the module.
Typical Application Circuit 6 Typical Application Circuit IO-Link Wireless Master Module 10
Pin Assignment 7 Pin Assignment The following table gives an overview of all pin functions: Pin 1 2 3 4 5 6 7 8 Name GND GND MS_DIO_4 MS_JTAG_TMSC MS_JTAG_TCKC MS_DIO_5 MS_DIO_6 SYNC Function Ground Ground Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Note Debug MS 0 cJTAG TMSC MS1 cJTAG TCKC MS1 Debug MS 1 Debug MS 2 Sync: SubCycle clk (T=1664 µs) Output if module configured as Sync Master 9 10 GND MS_nRESET Ground Digital Input 11 MM_nRESET Digital Input 12 13 14 15 16
Firmware 8 Firmware The module is delivered with a pre-installed firmware containing parts of a low-layer IO‑Link Wireless protocol stack for the IO-Link Wireless-Master. A detailed description of the protocol stack can be found in the IO-Link Wireless System Extensions v1.1 which can be downloaded from the IO-Link Homepage: https://io-link.com. The firmware includes the implementation of the physical layer (PL) and data link layer (DL).
Host Interface 9 Host Interface For the connection to the host controller the KE2640MODA2 uses a 4-wire serial peripheral interface (SPI) with two additional handshake signals (REQ and READY). The KE2640MODA2 operates as SPI master with a maximum data rate of 12 Mbps in this configuration. If more than one KE2640MODA2 is connected to one host controller, two additional signals are required for synchronization of the KE2640MODA2 (SYNC and FREQ_READY).
Host Interface In this configuration, the following occurs during idle periods: – CLK is forced high – nCS is forced high – The transmit data line MOSI is arbitrarily forced low – As the KE2640MODA2 is configured as a SPI master, the KE2640MODA2 enables the CLK pad If valid data has to be transmitted, the start of transmission is triggered by the nCS master signal going low. The master MOSI output pad is enabled.
Antenna Gain Setting 10 Antenna Gain Setting This module supports the setting of the gain of the connected antenna. The setting mechanism is accessible via the host controller software library, that is required for module operation. The gain setting mechanism reduces the maximum module output power of 10 dBm by the amount of the selected antenna gain in 1 dB steps. For the certification of the module with its reference antennas, the following antenna gain settings were used: Antenna U.
Layout Guidelines 11 Layout Guidelines KE2640MODA2 Module 11.1 PCB Specification PCB Stack-Up The following figure shows an example stack-up for a KE2640MODA2 design. The user can adapt the layer stack-up according to his own requirements. In this case the correct impedance of 50 Ω has to be ensured. Ideally this is done in cooperation with the selected PCB manufacturer. With this example stack-up, the width of a 50 Ω track is about 448 µm.
Layout Guidelines 11.2 Layout An example layout is shown in the following by means of a KUNBUS breakout board. Layer 1 - Top Layer 448µm GND plane (whole grey area) On this layer the module is connected to its periphery. The unused areas are filled with copper that is connected to GND potential. The GND pins of the module are connected directly to this GND plane to receive best possible GND connection with low impedance.
Layout Guidelines Layer 3 - Signal GND plane 3.3 V plane This layer is used for supply planes (3.3V and GND).
Layout Guidelines Layer 4 - Bottom Layer GND plane This layer is used for routing signals. Unused areas are filled with GND plane.
Footprint Indications 12 Footprint Indications 12.
Footprint Indications 12.2 Dimensions The outline dimensions of the module are as shown below. Top View Side View Suggested Land Pattern, all dimensions in mm.
Contact Details 13 Contact Details Your points of contact for all questions related to development, delivery, support and quotations are: Address KUNBUS GmbH Heerweg 15C 73770 Denkendorf Technical Support Sales Germany E-Mail: support@kunbus.com Tel.: +49 (0)711 300 20 678 E-Mail: info@kunbus.com For any request, please use the following reference: Article Name: IOLW Master Module Order No.
KUNBUS GmbH IO-Link Wireless Master Module 23
