Data Sheet

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Table Of Contents

Datasheet

Sterling™-EWB

Version 0.1

Summary of content (40 pages)

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A Datasheet Sterling™-EWB Version 0.
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Sterling™-EWB Datasheet CONTENTS 1 2 Scope .................................................................................................................................................................................. 4 Introduction .......................................................................................................................................................................... 5 2.1 General Description............................................................................
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Sterling™-EWB Datasheet 10.1 Overview .................................................................................................................................................................. 28 10.2 Soldering Recommendations ................................................................................................................................... 28 10.2.1 10.3 Reflow for Lead Free Solder Paste ..........................................................................................
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Sterling™-EWB Datasheet 2 INTRODUCTION 2.1 General Description The Laird Connectivity Sterling™-EWB is a high performance 2.4 GHz WLAN and Bluetooth combo module based on latest-generation silicon (Cypress’s CYW4343W) with an integrated ST Micro STM32F412 Cortex M4 MCU. With an industrial temperature rating, broad country certifications, and the availability of three different package styles, the Sterling™-EWB provides significant flexibility to meet various end user application needs.
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Sterling™-EWB Datasheet Microcontroller  STM32 Arm 32-bit Cortex™-M4 with a frequency up to 100 MHz  1 MB internal flash  256 kB of SRAM  2 MB SPI flash     SPI, QSPI, USART, PCM ADC, I2C, I2S, GPIO, Timers JTAG WICED Fully compatible Wireless Security System Features – Supported Modes  Open (no security)  WEP  WPA Personal  WPA2 Personal  WMM  WMM-PS (U-APSD)      WMM-SA WAPI AES (Hardware accelerator) TKIP (host-computed) CKIP (SW support) 2.
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Sterling™-EWB Datasheet  453-00014 - Chip Antenna Module This module variant integrates the 453-00012 Base SiP Module, a chip antenna, and all associated RF matching components on a PCB. This integrated approach not only provides an external antenna solution, but also simplifies and reduces the cost of the end users host board by simplifying the module PCB footprint. Figure 3 Sterling™-EWB Chip Antenna Module (453-00014) 4 ORDERING INFORMATION Part Number Description 453-00013C Sterling™-EWB U.
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Sterling™-EWB Datasheet Part Number Description 001-0014 2.4 GHz FlexPIFA antenna 001-0015 2.4 GHz FlexNotch antenna 001-0030 2.4 GHz Metal FlexPIFA antenna w/U.FL cable, 100 mm MAF94045 2.4 GHz NanoBlue Antenna https://connectivity.lairdtech.com/wireless-modules 8 © Copyright 2019 Laird.
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Sterling™-EWB Datasheet 5 BLOCK DIAGRAM VDD_MCU VBAT VDD_WIFI_IO I2C VDD_WIFI VDD_WIFI_PA CLK_REQ SPI BT_PCM BT_GPIO BT_REG_ON BT_DEV_WAKE QSPI Bluetooth BT_HOST_WAKE UART BT_UART 2.4GHz Chip Antenna USB STM32F412 CAN WLAN_REG_ON I2S WL_IRQ ADC/DAC WLAN LPF Match WLAN_SDIO Coaxial Connector TIMER GPIO 32.768kHz JTAG Match CYW4343W RF interface option 32.768kHz RTC 2MB Flash 26MHz REF CLK 37.4MHz REF CLK Base SiP Module Laird Sterling-EWB Figure 4: Sterling™-EWB U.
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Sterling™-EWB Datasheet 6 Note: 6.1 BASE SIP MODULE FOOTPRINT AND PIN DEFINITIONS The following footprint and pin definitions apply to the Sterling™-EWB base SiP module (453-00012). There are two module footprints, depending on which variant of the module is used. It is important to ensure you are using the correct version on your design. Base SiP Module Footprint Figure 5: Sterling™-EWB base SiP module pinout (top view) https://connectivity.lairdtech.com/wireless-modules 10 © Copyright 2019 Laird.
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Sterling™-EWB Datasheet 6.
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Sterling™-EWB Datasheet Module Name I/O Type Description STM32F412 Port 32 MICRO_USART1_CTS DI USART1_CTS PA11 33 MICRO_USART1_RTS DO USART1_RTS PA12 34 GND GND GROUND 35 MICRO_JTAG_TMS DI JTAG_TMS 36 GND GND GROUND 37 MICRO_JTAG_TCK DI JTAG_TCK PA14 38 MICRO_JTAG_TDI DI JTAG_TDI PA15 39 GND GND GROUND 40 NC - NO CONNECT (DO NOT CONNECT) 41 GND GND GROUND 42 VDD3V3_WIFI PI WIFI POWER SUPPLY 43 VDD3V3_WIFI PI WIFI POWER SUPPLY 44 GND GND GROUND 45
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Sterling™-EWB Datasheet Module STM32F412 Port Name I/O Type Description VDD_3V3 PI DC SUPPLY FOR MCU AND I/O 66 GND GND GROUND 67 QUADSPI_BK1_IO1 DIO QUADSPI_BK1_IO1 68 QUADSPI_BK1_IO2 DIO QUADSPI_BK1_IO2 PF7 69 MICRO_I2S2_SD DIO I2S2_SD PC3 70 GND GND GROUND 71 GND GND GROUND 72 GND GND GROUND 73 GND GND GROUND 74 MICRO_SPI1_NSS DIO SPI1_NSS PA4 75 MICRO_SPI1_SCK DIO SPI1_SCK PA5 76 MICRO_SPI1_MISO DIO SPI1_MISO PA6 77 GND GND GROUND 78 QUADSPI
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Sterling™-EWB Datasheet Module Pin 99 Name I/O Type Description GND GND GROUND STM32F412 Port 100 NC - NO CONNECT (DO NOT CONNECT) 101 GND GND GROUND 102 MICRO_I2C1_SCL DIO I2C1_SCL PB6 103 MICRO_I2C1_SDA DIO I2C1_SDA PB7 104 BOOT0 DO BOOT0 BOOT0 105 NC - NO CONNECT (DO NOT CONNECT) 106 MICRO_GPIO0 DIO MICRO_GPIO PE3 107 QUADSPI_BK2_NCS DIO QUADSPI_BK2_NCS PC11 108 MICRO_GPIO30 DIO MICRO_GPIO PE0 109 NC - NO CONNECT (DO NOT CONNECT) 110 NC - NO CONNE
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Sterling™-EWB Datasheet Module Name I/O Type Description STM32F412 Port 133 QUADSPI_BK1_NCS DIO QUADSPI_BK1_NCS PG6 134 GND GND GROUND 135 GND GND GROUND Pin 136 NC - NO CONNECT (DO NOT CONNECT) 137 MICRO_GPIO26 DIO MICRO_GPIO 138 NC - NO CONNECT (DO NOT CONNECT) 139 NC - NO CONNECT (DO NOT CONNECT) 140 NC - NO CONNECT (DO NOT CONNECT) 141 NC - NO CONNECT (DO NOT CONNECT) 142 MICRO_GPIO28 DIO MICRO_GPIO PB8 143 MICRO_I2S2_WS DIO I2S2_WS PB9 144 BT_PCM_S
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Sterling™-EWB Datasheet 7 U.FL/CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS Note: The following footprint and pin definitions apply to the Sterling™-EWB U.FL and chip antenna variants of the module (453-00013 and 453-00014). There are two module footprints depending on which variant of the module is being used, so it is important to ensure you are using the correct version on your design. 7.1 U.
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Sterling™-EWB Datasheet Module Name I/O Type Description 2 MICRO_ADC_IN2/PA2 DIO ADC INPUT OR GENERAL-PURPOSE I/O 3 MICRO_SPI1_SCK/PA5 DIO SPI SCK OR GENERAL-PURPOSE I/O 4 MICRO_SPI1_NSS/PA4 DIO SPI NSS OR GENERAL-PURPOSE I/O 5 MICRO_SPI1_MISO/PA6 DIO SPI MISO OR GENERAL-PURPOSE I/O 6 MICRO_ADC_IN3/PA3 DIO ADC INPUT OR GENERAL-PURPOSE I/O 7 MICRO_GPIO_5/PB0 DIO GENERAL-PURPOSE I/O 8 QUADSPI_BK2_IO2/PC4 DIO QSPI IO2 OR GENERAL-PURPOSE I/O 9 VDD_WIFI_PA PI WIFI AND BLUETOOT
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Sterling™-EWB Datasheet Module Name I/O Type Description 35 VDD_USB PI VUSB POWER SUPPLY 36 QUADSPI_BK1_NCS/PG6 DIO QSPI NCS OR GENERAL-PURPOSE I/O 37 VDD_MCU PI MCU AND IO POWER SUPPLY 38 MICRO_I2S2_CK/MICRO_USART6_RX/PC7 DIO I2S CK OR USART RX INPUT OR GENERAL-PURPOSE I/O 39 MICRO_I2S2_MCK/MICRO_USART6_TX/PC6 DIO I2S MCK OR USART TX OUTPUT OR GENERAL-PURPOSE I/O 40 GND12 Pin GND GROUND PI WIFI AND BLUETOOTH IO POWER SUPPLY 41 VDD_WIFI_IO 42 MICRO_USART1_RX/PA10 DI MCU
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Sterling™-EWB Datasheet Module Name I/O Type Description 66 QUADSPI_BK1_IO0/PF8 DIO QSPI IO0 OR GENERAL-PURPOSE I/O 67 QUADSPI_BK2_NCS/PC11 DIO QSPI NCS OR GENERAL-PURPOSE I/O 68 QUADSPI_BK1_IO1/PF9 DIO QSPI IO1 OR GENERAL-PURPOSE I/O 69 MICRO_I2S2_WS/PB9 DIO I2S WS OR GENERAL-PURPOSE I/O 70 QUADSPI_BK1_IO3/PF6 DIO QSPI IO3 OR GENERAL-PURPOSE I/O 71 MICRO_GPIO_30/PE0 DIO GENERAL-PURPOSE I/O Pin 72 OSC_32K_IN DI EXTERNAL SLEEP CLOCK INPUT (not used) 73 MICRO_I2S_DI/PE5 DIO
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Sterling™-EWB Datasheet Characteristic Description Model Name Sterling™-EWB Product Description Wi-Fi and Bluetooth Wireless Module with Cortex™-M4 MCU SiP Module Dimensions (W x L x T) – mm (in.) 10 x 10 x 1.2 (0.39 x 0.39 x 0.05) Antenna Option Module Dimensions (W x L x T) – mm (in.) 16 x 21 x 2.8 (0.63 x 0.83 x 0.11) Operating Temperature – °C (°F) -40 to +85 (-40 to +185) Storage Temperature – °C (°F) -40 to +125 (-40 to +257) Weight TBD 8.
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Sterling™-EWB Datasheet Rating Value Unit VDD_USB 0 to 4 V VBAT 0 to 4 V Voltage ripple any supply input (not to exceed operating voltage) ±2% Not to exceed operating voltage Output current sunk by any I/O or control pin 25 mA Output current sourced by any I/O or control pin -25 mA Total output current sunk by sum of all I/O or control pin 120 mA Total output current sourced by sum of all I/O or control pin -120 mA 8.
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Sterling™-EWB Datasheet 8.6 WLAN RF Characteristics 8.6.1 WLAN Transmitter Characteristics (TA = +25°C, VCC = 3.3 V) Parameter 1 Mbps DSSS (b) TX Output Power 2 Mbps DSSS (b) TX Output Power 5.
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Sterling™-EWB Datasheet Parameter Test Conditions 52 Mbps 64-QAM 802.11(n) Mask Compliance MCS5 OFDM (n) TX Output Power MCS6 OFDM (n) TX Output Power -22 dB EVM RMS power over TX packet 58.5 Mbps 64-QAM 802.11(n) Mask Compliance MCS7 OFDM (n) TX Output Power -25 dB EVM RMS power over TX packet 65 Mbps 64-QAM 802.11(n) Mask Compliance -27 dB EVM RMS power over TX packet Min Typ Max Unit - 12.5 - dBm - 12.5 - dBm - 12.5 - dBm 8.6.2 WLAN Receiver Characteristics (TA = +25°C, VCC = 3.
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Sterling™-EWB Datasheet Parameter Test Conditions Min Typ Max Unit 11b RX Overload Level 8% PER, 11 Mbps -10 - - dBm 11g RX Overload Level 10% PER, 54 Mbps -20 - - dBm 11n RX Overload Level 10% PER, MCS7 -20 - - dBm 8.7 Bluetooth RF Characteristics 8.7.1 Bluetooth Transmitter GFSK & EDR Characteristics (TA=25°C, VDD=3.3 V) Parameter Test Conditions Min Typical Max Bluetooth Spec Unit GFSK RF Output Power - 8.5 - dBm EDR RF Output Power - 4.
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Sterling™-EWB Datasheet 8.7.4 BLE Receiver Characteristics (TA=25°C, VDD=3.3 V) Table 5: BLE receiver RF characteristics Parameter Test Conditions Min Typical Max Bluetooth Spec Unit GFSK Sensitivity PER = 30.8% - -94 - -70 dBm GMSK Maximum Input Level PER = 30.8% - -20 - -20 dBm 9 MCU INTERFACE CHARACTERISTICS 9.1 DC Characteristics – General Input and Output Table 6: DC characteristics MCU I/O Parameter Test Conditions Min Max Unit Logic input low, V IL 2.4V ≤ VDD_MCU ≤ 3.
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Sterling™-EWB Datasheet 9.2 I2C Interface 9.2.1 Overview The Sterling™-EWB Module MCU section supports Standard and Fast mode I2C communication. VDD_MCU Sterling-EWB 4.7 kΩ I2C bus 4.7 kΩ 100 Ω { SDA SCL 100 Ω Table 7: Signal connections to I2C bus Symbol Standard (1) Mode Parameter Fast (1)(2) Mode Unit Min Max Min Max tw(SCLL) SCL clock low time 4.7 - 1.3 - µs tw(SCLH) SCL clock high time 4.0 - 0.
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Sterling™-EWB Datasheet Measurement points are done at 0.3V DD and 0.7VDD 9.3 SPI Interface Table 8: SPI interface characteristics Parameter Test Conditions Min Typical Max SPI Clock Frequency Master full duplex/receiver mode 2.7V < VDD_MCU <3.6V SPI1/4/5 - - 42 Master full duplex/receiver mode 3.0V < VDD_MCU <3.6V SPI1/4/5 - - 50 Master transmitter mode 2.4V < VDD_MCU <3.6V SPI1/4/5 - - 50 Master mode 2.4V < VDD_MCU <3.6V SPI1/2/3/4/5 - - 25 Slave transmitter/full duplex mode 2.
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Sterling™-EWB Datasheet 10 MCU UART INTERFACES 10.1 Overview The Sterling™-EWB is configurable for up to three UART interfaces for serial communications. The UART is a standard 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 9600 bps to 4.0 Mbps. The interface features an automatic baud rate detection capability that returns a baud rate selection. The baud rate may also be selected through a vendor-specific UART HCI command.
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Sterling™-EWB Datasheet 11 註解 [RG1]: The Sterling-EWB uses Laird’s OUI not legacy LSR’s. It will probably be a good idea to put Laird’s OUI in the table so there is no confusion later WI-FI MAC IDS/BLUETOOTH MAC IDS Table 9: Example of MAC ID assignments 12 Wi-Fi MAC ID Bluetooth MAC ID Module 1 00:25:CA:07:00:01 00:25:CA:07:00:02 Module 2 00:25:CA:07:00:03 00:25:CA:07:00:04 Module 3 00:25:CA:07:00:05 00:25:CA:07:00:06 Module 4 00:25:CA:07:00:07 00:25:CA:07:00:08 MECHANICAL DETAILS 12.
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Sterling™-EWB Datasheet 12.2 Base SiP Module PCB Footprint Figure 10: Base SiP module footprint (top view) Note: Pad Sizes Solder Mask Type A – mm (in.) 0.424 x 0.424 (0.017 x 0.017) 0.524 x 0.524 mm (0.021 x 0.021) Type B – mm (in.) 0.275 x 0.325 (0.011 x 0.013) 0.35 x 0.40 (0.014 x 0.016) Type C – mm (in.) 2.7 x 2.7 (0.106 x 0.106) 2.8 x 2.8 (0.110 x 0.110) https://connectivity.lairdtech.com/wireless-modules 30 © Copyright 2019 Laird.
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Sterling™-EWB Datasheet 12.3 Base SiP Module Recommended Solder Stencil Figure 11: Base SiP module recommended solder stencil (top view) Note: Solder mask and paste mask to be adjusted according to end-users assembly process. https://connectivity.lairdtech.com/wireless-modules 31 © Copyright 2019 Laird.
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Sterling™-EWB Datasheet 註解 [RG2]: This is ready to add to the datasheet 12.4 Base SiP Module Tape and Reel Packaging 註解 [SW3]: Where can I grab it from? {Tape Dimensions Diagram} (Module must be in this Orientation when Feeding Tape) Figure 13 Base SiP Module Tape and Reel Specification 12.5 U.FL and Chip Antenna PCB Footprint Figure 15 U.FL and Chip Antenna Host PCB Footprint https://connectivity.lairdtech.com/wireless-modules 32 © Copyright 2019 Laird.
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Sterling™-EWB Datasheet 12.6 U.FL and Chip Antenna Tape and Reel Packaging 註解 [RG4]: This is ready to add to the datasheet {Module Tape and Reel dimensions} 註解 [SW5]: Where can I grab it from? Figure 16 U.FL and Chip Antenna Modules Tape and Reel Specification 12.7 Device Markings 12.7.1 SiP Module 註解 [RG6]: This is ready to add to the datasheet The shield on the 453-00012 base module contains the following information: 註解 [SW7]: Where can I grab it from? TBD 12.7.
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Sterling™-EWB Datasheet 16 SHIPPING, HANDLING, AND STORAGE 16.1 Shipping Bulk orders of the Sterling™-EWB base module are delivered in reels of 2000. Bulk orders for the antenna option PCBAs are delivered in reels of 1000. 16.2 Handling The Sterling™-EWB modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may damage the module permanently. 16.
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Sterling™-EWB Datasheet 17 REGULATORY 17.1 FCC and IC Regulatory – Pending This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
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Sterling™-EWB Datasheet RF Exposure Considerations 20-centimeter separation distance and co-located issue shall be met at mentioned in Summarize the specific operational use conditions. The product manufacturer shall provide the text below in the end-product manual: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body.
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Sterling™-EWB Datasheet Brand Name Model Name Antenna Type Antenna Gain Antenna Connector Laird 001-0014 FlexPIFA 2.0 U.FL Laird 001-0015 FlexNotch 2.0 U.FL Laird 001-0030 PIFA 2.0 U.FL Laird NanoBlue/ EBL2400A1-10MH4L PCB Dipole 2.0 U.FL Radiation Exposure Statement: This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
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Sterling™-EWB Datasheet 17.2 Europe – EU Declaration of Conformity This device complies with the essential requirements of the Radio Equipment directive: 2014 / 53 / EU. The following test methods have been applied in order to prove presumption of conformity with the essential requirements o f the Radio Equipment directive: 2014 / 53 / EU:        EN 300 328 V2.1.1 Draft EN 301 489-1 V2.2.0 Draft EN 301 489-17 V3.2.
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Sterling™-EWB Datasheet If this device is used in a product, the OEM has responsibility to verify compliance of the final end product to the Australia/New Zealand (RCM) Standards. All end-products require their own certification (SDoc). You will not be able to leverage the module certification and ship product into the country. 18 BLUETOOTH SIG QUALIFICATION 18.1 Overview The Sterling™-EWB module is listed on the Bluetooth SIG website as a qualified Controller Subsystem.
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Sterling™-EWB Datasheet Your new design will be listed on the SIG website and you can print your Certificate and SDoC. For further information please refer to the following training material: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates 18.3 Additional Assistance Please contact your local sales representative or our support team for further assistance: Email wireless.support@lairdtech.