Data Sheet

LWB5+
Datasheet
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15.3 SurfaceMountConditions
The following soldering conditions are recommended to ensure device quality.
15.3.1 Soldering
Note: When soldering, the stencil thickness should be ≥ 0.1 mm.
Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment)
 Measuring point – IC package surface
 Temperature profile:
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Figure 12: Temperature profile