Data Sheet

LWB5+
Datasheet
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15.3.2 CautionsWhenRemovingtheSIPfromthePlatformforRMA
 Bake the platform before removing the SIP from the platform. Reference baking conditions.
 Remove the SIP by using a hot air gun. This process should be carried out by a skilled technician.
Suggestion conditions:
 One-side component platform:
– Set the hot plate at 280°C.
– Put the platform on the hot plate for 8~10 seconds.
– Remove the SIP from platform.
 Two-side components platform:
– Use two hot air guns
– On the bottom side, use a pre-heated nozzle (temperature setting of 200~250°C) at a suitable distance from the
platform PCB.
– On the top side, apply a remove nozzle (temperature setting of 330°C). Heat the SIP until it can be removed from
platform PCB.
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 Remove the residue solder under the bottom side of SIP.
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(Not accepted for RMA) (Accepted for RMA analysis)
SIP with residue solder on the bottom SIP without residue solder on the bottom
 Remove and clean the residue flux is needed.
15.3.3 PrecautionsforUse
 Opening/handing/removing must be done on an anti-ESD treated workbench.
All workers must also have undergone anti-ESD treatment.
 The devices should be mounted within one year of the date of delivery.
Platform PCB
SIP
Remove Nozzle
Pre-heat Nozzle