Data Sheet

ManualsBrandsLaird Connectivity ManualsElectronics802.11n 2.4GHz + BT5.2 Module

Table Of Contents

1 Scope
2 Introduction
- 2.1 General Description
3 Module Variants
- 3.1 453-00083 - Base SiP module
- 3.2 453-00084 – MHF® 4 module
- 3.3 453-00085 – Chip Antenna module
- 3.4 453-00141 – Module, Sterling LWB+, M.2, Key E, SDIO, UART
4 Functional Description
- 4.1 WLAN Features
- 4.2 Bluetooth Features
- 4.3 Wireless Security System Features
5 Block Diagrams
6 General characteristics
7 Electrical Characteristics
- 7.1 Absolute Maximum Ratings
- 7.2 Recommended Operating Conditions
- 7.3 Digital IO Pin DC Characteristics
- 7.4 WLAN RF Characteristics
  - 7.4.1 WLAN RF TX Characteristics (VBAT=3.3V, TA=25 ℃)
  - 7.4.2 WLAN RF RX Characteristics (VBAT=3.3V, TA=25 ℃)
- 7.5 Bluetooth RF Characteristics
  - 7.5.1 Bluetooth TX RF Characteristics (VBAT=3.3V, TA=25 ℃)
  - 7.5.2 Bluetooth RX RF Characteristics (VBAT=3.3V, TA=25 ℃)
- 7.6 Current consumption
  - 7.6.1 WLAN Current consumption
  - 7.6.2 Bluetooth Current consumption
8 Pin Definitions
- 8.1 Base SIP Pin Definitions
- 8.2 MHF®4 and Chip Antenna Module Pin Definitions
- 8.3 M.2 2230, E-key, SDIO/UART module Pin Definitions
9 Power States
- 9.1 Module power states
- 9.2 MHF® 4 and Chip antenna module pin I/O states
10 Crystal Oscillator Requirement
11 Power-On Signal Timing Diagrams
12 Host interface
- 12.1 WLAN SDIO interface
- 12.2 Bluetooth UART interface
13 Mechanical Specifications
- 13.1 Base SIP Module Footprint
- 13.2 MHF®4 and Chip Antenna module footprint
- 13.3 M.2 2230, E-key, SDIO/UART module drawing.
- 13.4
14 Soldering Recommendations
- 14.1 Reflow for lead Free Solder Paste
- 14.2 Recommended Reflow Profile for lead Free Solder Paste
15 Wi-Fi / Bluetooth MAC ID
16 Miscellaneous
- 16.1 Cleaning
- 16.2 Rework
- 16.3 Handling and Storage
17 Regulatory
- 17.1 FCC Statement
- 17.2 IC Statement
- 17.3 Professional installation instruction
- 17.4 Instructions d'installation professionnelle
18 Ordering information
19 Bluetooth SIG Qualification
- 19.1 Overview
- 19.2 Qualification Steps When Referencing a Laird Connectivity Controller Subsystem Design
20 Additional Assistance

Sterling™ LWB+

Datasheet

https://www.lairdconnect.com/

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852-2762-4823

12 HOST INTERFACE

12.1 WLAN SDIO interface

The Sterling LWB+ module WLAN section supports SDIO version 2.0. for both 1-bit (25 Mbps) and 4-bit modes (100 Mbps), as

well as high speed 4-bit mode (50 MHz clocks—200 Mbps).

Figure 13: Signal connections to SDIO host (SD 4-bit mode)

Note: Pull-ups (10K to 100K) are required on data and CMD lines. This is required during all operating states by either

external resistors or through pull-ups on the host device.

Figure 14: Signal connections to SDIO host (SD 1-bit mode)

Note: Pull-ups (10K to 100K) are required on data and CMD lines. This is required during all operating states by either

external resistors or through pull-ups on the host device.