Data Sheet

Sterling™ LWB+
Datasheet
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15 WI-FI / BLUETOOTH MAC ID
For the Sterling LWB+, the Wi-Fi MAC ID and Bluetooth MAC ID is preprogrammed during production for each module. The
Bluetooth MAC ID is the Wi-Fi MAC ID plus one and Wi-Fi MAC ID is shown in the barcode on the shielding can.
Table 17: Example MAC ID assignments
Wi-Fi MAC ID
Bluetooth MAC ID
Module 1
C0EE40B00000
C0EE40B00001
Module 2
C0EE40B00002
C0EE40B00003
Module 3
C0EE40B00004
C0EE40B00005
Module 4
C0EE40B00006
C0EE40B00007
16 MISCELLANEOUS
16.1 Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
 Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the
module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
 Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not
accessible for post-washing inspection. The solvent could also damage any stickers or labels.
 Ultrasonic cleaning could damage the module permanently
16.2 Rework
The Sterling LWB+ module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are
met as described in this datasheet.
Never attempt a rework on the module itself, e.g. replacing individual components. Such actions terminate warranty coverage.
16.3 Handling and Storage
16.3.1 Handling
The Sterling LWB+ modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may
damage the module permanently
16.3.2 Moisture Sensitivity Level (MSL)
The Sterling-LWB+ SIP and SMT modules are MSL level 4.
Per J-STD-020, devices rated as MSL 4 and not stored in a sealed bag with desiccant pack should be baked prior to use.
Devices are packaged in a Moisture Barrier Bag with a desiccant pack and Humidity Indicator Card (HIC). Devices that will be
subjected to reflow should reference the HIC and J-STD-033 to determine if baking is required.
If baking is required, refer to J-STD-033 for bake procedure.
16.3.3 Storage
Per J-STD-033, the shelf life of devices in a Moisture Barrier Bag is 12 months at <40C and <90% room humidity (RH).
Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive mechanical shock.