Data Sheet

ManualsBrandsLaird Connectivity ManualsElectronics802.11n 2.4GHz + BT5.2 Module

Table Of Contents

1 Scope
2 Introduction
- 2.1 General Description
3 Module Variants
- 3.1 453-00083 - Base SiP module
- 3.2 453-00084 – MHF® 4 module
- 3.3 453-00085 – Chip Antenna module
- 3.4 453-00141 – Module, Sterling LWB+, M.2, Key E, SDIO, UART
4 Functional Description
- 4.1 WLAN Features
- 4.2 Bluetooth Features
- 4.3 Wireless Security System Features
5 Block Diagrams
6 General characteristics
7 Electrical Characteristics
- 7.1 Absolute Maximum Ratings
- 7.2 Recommended Operating Conditions
- 7.3 Digital IO Pin DC Characteristics
- 7.4 WLAN RF Characteristics
  - 7.4.1 WLAN RF TX Characteristics (VBAT=3.3V, TA=25 ℃)
  - 7.4.2 WLAN RF RX Characteristics (VBAT=3.3V, TA=25 ℃)
- 7.5 Bluetooth RF Characteristics
  - 7.5.1 Bluetooth TX RF Characteristics (VBAT=3.3V, TA=25 ℃)
  - 7.5.2 Bluetooth RX RF Characteristics (VBAT=3.3V, TA=25 ℃)
- 7.6 Current consumption
  - 7.6.1 WLAN Current consumption
  - 7.6.2 Bluetooth Current consumption
8 Pin Definitions
- 8.1 Base SIP Pin Definitions
- 8.2 MHF®4 and Chip Antenna Module Pin Definitions
- 8.3 M.2 2230, E-key, SDIO/UART module Pin Definitions
9 Power States
- 9.1 Module power states
- 9.2 MHF® 4 and Chip antenna module pin I/O states
10 Crystal Oscillator Requirement
11 Power-On Signal Timing Diagrams
12 Host interface
- 12.1 WLAN SDIO interface
- 12.2 Bluetooth UART interface
13 Mechanical Specifications
- 13.1 Base SIP Module Footprint
- 13.2 MHF®4 and Chip Antenna module footprint
- 13.3 M.2 2230, E-key, SDIO/UART module drawing.
- 13.4
14 Soldering Recommendations
- 14.1 Reflow for lead Free Solder Paste
- 14.2 Recommended Reflow Profile for lead Free Solder Paste
15 Wi-Fi / Bluetooth MAC ID
16 Miscellaneous
- 16.1 Cleaning
- 16.2 Rework
- 16.3 Handling and Storage
17 Regulatory
- 17.1 FCC Statement
- 17.2 IC Statement
- 17.3 Professional installation instruction
- 17.4 Instructions d'installation professionnelle
18 Ordering information
19 Bluetooth SIG Qualification
- 19.1 Overview
- 19.2 Qualification Steps When Referencing a Laird Connectivity Controller Subsystem Design
20 Additional Assistance

Sterling™ LWB+

Datasheet

https://www.lairdconnect.com/

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852-2762-4823

3.3 453-00085 – Chip Antenna module

This module variant integrates the 453-00083 Base SiP Module, a ceramic chip antenna, and all associated RF matching

components on a PCB. This integrated antenna module simplifies and reduces the cost for the host integration of using the

module.

Figure 3: Sterling LWB+ Chip Antenna module (453-00085)

3.4 453-00141 – Module, Sterling LWB+, M.2, Key E, SDIO, UART

This M.2 2230, E-key, SDIO/UART module variant integrates the 453-00083 Base SiP Module, a MHF4 RF connector, and all

associated RF matching components on a PCB. This integrated MHF4 connector, and the M.2 2230 form factor provide an

industrial standard for the host integration when using the module.

Figure 4: Sterling LWB+ M.2 2230, E-key, SDIO/UART module (453-000141)