Data Sheet
Table Of Contents
- 1 Overview and Key Features
- 1.2 Application Areas
- Features and Benefits
- 2 Specifications
- 3 Hardware Specifications
- 3.1 Block Diagram and Pin-out
- 3.2 Pin Definitions
- 3.3 Electrical Specifications
- 4 Functional Description
- 4.1 Power Management (includes brown-out and power on reset)
- 4.2 Clocks and Timers
- 4.3 RF
- 4.4 UART Interface
- 4.5 SPI Bus
- 4.6 I2C Interface
- 4.7 General Purpose I/O, ADC and PWM/FREQ
- 4.8 nRESET Pin
- 4.9 nAutoRUN Pin
- 4.10 RM1xx VSP Service and Modes
- 4.11 Two-Wire SWD Programming/Debug Interface
- 4.12 RM1xx on-board chip antenna characteristics
- 5 Hardware Integration Suggestions
- 6 Mechanical Details
- 7 Application Note for Surface Mount Modules
- 8 FCC and IC Regulatory Statements
- 9 CE Regulatory
- 10 EU Declarations of Conformity
- 11 Ordering Information
- 12 Bluetooth SIG Qualification
RM1xx LoRa/BLE Modules
Datasheet
https://connectivity.lairdtech.com/wireless-
modules/lorawan-solutions
32
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7.2 Reflow Parameters
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages
contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and
shipment. If directed to bake units on the card, see Table 23 and follow instructions specified by IPC/JEDEC J-STD-033. A
copy of this standard is available from the JEDEC website: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in in
Table 23, the modules must be removed from the shipping tray.
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new
humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment
≤30°C/60%RH.
Table 23: Recommended baking times and temperatures
MSL
125
°
C
Baking Temp.
90
°
C/≤ 5%RH
Baking Temp.
40
°
C/ ≤ 5%RH
Baking Temp.
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@
30°C/85%
Floor Life Limit
+ 72 hours
@ 30°C/60%
Saturated
@ 30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
3 9 hours 7 hours 33 hours 23 hours 13 days 9 days
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is
the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow
meet the requirements of the solder paste. Laird surface mount modules conform to J-STD-020D1 standards for reflow
temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 12: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in Table 24.