User's Manual

BT85x Series
Datasheet
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
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1.1.1.1 Packaging Process
Figure 20: Packaging process
12.3. Reflow Parameters
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven
temperatures during reflow meet the requirements of the solder paste. Laird’s surface mount modules conform
to J-STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 21: Recommended reflow temperature