Datasheet
104
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EMI ESSENTIALSEMI ESSENTIALS
MICROWAVE ABSORBERS
PRODUCT SELECTION GUIDE
AUTOMATED FORM-IN-PLACE
EMI GASKET TECHNOLOGIES
TABLE 3. MATERIAL SPECIFICATIONS
TEST METHOD UNIT SNC70-RXP SNK55-RXP SNL60-RXP SNN60-RXP SIL25-RXP
SNC70-HXP SNK60-HXP SNL70-HXP SNN65-HXP SIL35-HXP
Elastomer Silicone Silicone Silicone Silicone Silicone Silicone Silicone Silicone Silicone Silicone
Filler
Nickel/
Graphite
Silver/Copper
Silver/
Aluminium
Silver/
Nickel
Non-
conductive
Nickel/
Graphite
Silver/
Copper
Silver/
Aluminium
Silver/
Nickel
Non-
Conductive
Color Gray Tan Tan Tan White Gray Tan Tan Tan Transparent
Electric Properties
Volume Resistivity
ohm-
cm
0.03 0.002 0.003 0.005 NA 0.03 0.004 0.005 0.005 NA
Shielding effectiveness
MIL-DTL-
83528C
200 MHz to 10 GHz Para. 4.5.12 dB >100 >90 >100 >100 NA >90 >90 >90 >100 NA
Mechanical Properties
Hardness ASTM D2240
Shore
A
70 55 60 60 25 70 60 70 65 35
Density (cured) ASTM D792 g/cm
3
2.5 3 2.1 3.9 1.2 2.5 3.1 2 3.84 1.1
Compression set ASTM D395 % 15 10 10 15 <20(a) 15 10 10 10(b) <20(b)
Adhesion strength (Al) LT-FIP-CLE-03 N/cm
2
150 200 140 180 220 >180 200 200 200 285
Compression deection LT-FIP-CLE-07
at 20% compression lb/in 1.5 1.2 1.9 1.7 See note (b) 3.2 1.5 2.3 See note (c)
at 40% compression lb/in 6.9 5.2 8.3 6.4 11.5 7.3 10.5
Temperature Range °C -50 to 125 -50 to 100 -50 to 125 -50 to 125 See note (b) -50 to 125 -50 to 125 -50 to 125 -50 to 125 See note (c)
UL rating UL-94 V0 V0 V0 V0 TBD V0 V0 V0 V0 TBD
Curing requirements
Curing conditions
15°C to
40°C, 50%
relative
humidity
15°C to
40°C, 50%
relative
humidity
15°C to
40°C, 50%
relative
humidity
15°C to
40°C, 50%
relative
humidity
23°C, 50%
RH
120°C 120°C 120°C 120°C 120°C
Handling time 1 hour 1 hour 1 hour 1 hour
10-25
minutes
Cure time 24 hours 24 hours 24 hours 24 hours
12 hrs/mm
thick
1 hour 1.5 hours 1 hours 1.5 hours 1 hour
(a) Test method ASTM D575
(b) Contact Laird Application Engineering for test data.
HEIGHT WIDTH
MINIMUM
LANDING AREA
0.014 ± 0.003 (0,4 ± 0,1) 0.015 ± 0.003 (0,4 ± 0,1) 0.020 (0,5)
0.015 ± 0.003 (0,4 ± 0,1) 0.020 ± 0.003 (0,5 ± 0,1) 0.025 (0,6)
0.020 ± 0.003 (0,5 ± 0,1) 0.024 ± 0.003 (0,6 ± 0,1) 0.029 (0,7)
0.027 ± 0.004 (0,7 ± 0,1) 0.030 ± 0.004 (0,8 ± 0,1) 0.036 (0,9)
0.030 ± 0.004 (0,8 ± 0,1) 0.034 ± 0.004 (0,9 ± 0,1) 0.040 (1,0)
0.040 ± 0.004 (1,0 ± 0,1) 0.048 ± 0.005 (1,2 ± 0,1) 0.055 (1,4)
0.045 ± 0.005 (1,1 ± 0,1) 0.059 ± 0.006 (1,5 ± 0,2) 0.067 (1,7)
0.055 ± 0.006 (1,4 ± 0,2) 0.075 ± 0.007 (1,9 ± 0,2) 0.084 (2,1)
TABLE 1.
TYPICAL BEAD DIMENSIONS
CONDITIONS
50%RELATIVE HUMIDITY,
0.024 IN. (0,6 MM) BEAD
Temperature °F (°C) 73 (23) 140 (60) 185 (85)
Time for 98% Cure (Hr.) 12 2 1
TABLE 2.
ACCELERATED CURE AT HIGHER TEMPERATURES
Frequency Range Description Thickness Application
>10 GHz Q Zorb™ - 2000 .020” (0.5 mm)
Q-Zorb is thinner and
more robust
for surface currents.
Thicker is better
for low frequency.
>8 GHz Q Zorb™ - 2000 .040” (1.0 mm)
>4 GHz Q Zorb™ - 2000 .060” (1.5 mm)
<4 GHz Q Zorb™ - 2000 .125” (3.1 mm)
<2 GHz Q Zorb™ - 3000 .006” (0.15 mm)
<2 GHz Q Zorb™ - 3000 .020” (0.5 mm)
Refection Loss Broadband RF Foam - 4000 .50” (12.5 mm)
Foam is lighter, cheaper,
and thicker. Thicker is
better at low frequency.
Insertion Loss Broadband RF Foam - 5000 .125” (3.1 mm)
Insertion Loss Broadband RF Foam - 5000 .250” (6.25 mm)