Datasheet

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www.lairdtech.com
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www.lairdtech.com
EMI ESSENTIALSEMI ESSENTIALS
BOARD LEVEL SHIELDS
STANDARD DESIGN SHIELDS
STANDARD SURFACE MOUNT SHIELDS —
TWO-PIECE
Reduce Board Damage From Inspection and Repairs
Two-piece board level shields offer users the exibility to inspect or repair shielded components without having to risk board damage by
removing the entire shield or incur any tooling costs. Covers snap on and off with ease, which makes repair of the component under the
shield quicker and easier and reduces board re-work. Two-piece shields are available unassembled*, and are designed to survive drop,
shock and no-rattle tests.
*Pre-assembly is an option. Consult sales
STANDARD TWO-PIECE BOARD LEVEL SHIELDS
PART
NUMBER
OVERALL
LENGTH
in (mm)
OVERALL
WIDTH
in (mm)
OVERALL
HEIGHT
in (mm)
PARTS
PER REEL
BMI-S-201-F .538
(13,66)
.476
(12,10)
.100
(2,54)
1000
BMI-S-202-F .650
(16,50)
.650
(16,50)
.142
(3,60)
700
BMI-S-203-F 1.032
(26,21)
1.032
(26,21)
.200
(5,08)
300
BMI-S-204-F 1.260
(32,00)
1.260
(32,00)
.236
(6,00)
225
BMI-S-205-F 1.500
(38,10)
1.000
(25,40)
.236
(6,00)
250
BMI-S-206-F 1.450
(36,83)
1.326
(33,68)
.200
(5,08)
300
BMI-S-207-F 1.747
(44,37)
1.747
(44,37)
.384
(9,75)
120
BMI-S-209-F 1.156
(29,36)
0.728
(18,50)
.275
(7,00)
400
BMI-S-210-F 1.732
(44,02)
1.201
(30,50)
.118
(3,00)
370
BMI-S-230-F 1.500
(38,10)
2.000
(50,80)
.200
(5,08)
250
BMI-S-230-F-R 1.500
(38,10)
2.000
(50,80)
.200
(5,08)
250
BMI-S-305 1.500
(38,10)
1.000
(25,40)
.236
(6,00)
250
DESIGN PARAMETERS – ALL PART NUMBERS
PICK-UP SPOT
DIAMETER MATERIAL
MATERIAL THICKNESS
CARRIER TAPE
MATERIAL
6 mm or greater 0,20 mm CRS Tin, Nickel Silver, 300 Series SS 0,20 mm LTIMS-LCB
COVER TAPE MATERIAL REEL DIAMETER
LTIMS-PSA 330 mm (101, 102, 103, 104, 201, 202, 203, 204)
381 mm (105, 106, 107, 205, 206, 207)
Plastic EIA-481
Features and Benets:
• Offers exibility to inspect
or repair shield components
without risking board
damage
• Covers snap on and off
with ease
PATENTED SHIELDS ARE SCORED TO ALLOW PEEL-OFF WHEN ACCESS IS NEEDED
These patented shields have a solid top, scored to allow peel-off when access to board level components within
the shield is required.
The peel-off feature prevents damage to the board and components by eliminating the need for labor intensive
de-soldering, which can often result in increased scrap. Peeling off the cover is accomplished by using a small
starter hole for simple removal. This hand operation requires minimal force using a hook scriber or tweezers.
After repair, replacement or adjustment of internal components, the shield can be resealed using a replacement
cover. Laird offers two replacement cover options: a snap-in cover and a dish cover.
The snap-in cover utilizes a lance and hole design. The replacement cover snaps into place and locks into a lance
feature on the frame of the original shield.
The other option is a dish cover that gets soldered into place on the board. The dish shape allows for self-location
of the cover for soldering.
EZ Peel board level shields can be packaged in tape and reel formats for easy SMT installation using conventional
pick-and-place equipment. The four standard sizes are also available without the EZ Peel (scored) feature.
Features and Benets:
• Easy removal of scored cover area
• Only requires 1.5 lbs force for
cover removal
• Simple replacement technique
for cover
• Use on surface mount or
through-hole applications
• Shield retains all physical
properties after PCMCIA/JEIDA
testing for shock, bending, torque,
drop and vibration
• CRS 1008/1010 (tin plated)
for solderability
BOARD LEVEL SHIELDS
EZ PEEL
™
RIGID CORNER
The rigid corner board-level shield incorporates a corner design that optimizes component rigidity for increased part and printed circuit board
(PCB) firmness. As PCB designers are increasingly using thinner substrates, a rigid frame reinforces the assembly, thereby improving overall
ruggedness and performance. The shield has improved solder joint reliability and resistance to solder joint fracture, especially in drop testing
performance with thin PCBs. Several standard Laird EMI style parts including single-piece, two-piece, and multi-compartmental board-level
shields use this new rigid corner design, along with availability in custom sizes as well.
The rigid corner shield is stronger and more robust than traditional formed shields, which results in coplanarity improvement of the solder
castellations. The shield can tolerate more deflection (i.e., more handling) without plastic deformation. Elimination of drawn flange reduces
the space needed on the PCB for shielding trace width by potentially ~0.3 mm, allowing for the shield to be more closely placed on the PCB.
Elimination of draft allows for more undershield space and improved component clearance.
The partially drawn corner is located near the top portion the shield, resulting in improved torsional rigidity with no drawn lip and no draft.
For parts over 2 mm, the corner is both drawn and formed with an interlocking multi-radius corner, which provides superior EMI shielding
effectiveness. The interlocking corner can be meshed and closed in during the forming and drawing process for additional improved rigidity
for parts taller than 2 mm. For parts under 2 mm, the entire corner is drawn without an interlocking corner.
FEATURES
• Corner openings are reduced,
improving shielding performance
• Partially drawn corner located near the top
portion of the corner combined with 90°
straight forming of wall sections for improved
torsional rigidity.
• U.S. Patent No. 7,488,902
MARKETS
• Computing
• Telecommunications
• Data Transfer and Information
Technology
• Automotive
• Consumer Electronics
• Aerospace / Defense
• Medical
• Portability
• Industrial & Instrumentation
• Public Utilities