Datasheet

ManualsBrandsLaird ManualsFiltersEcE Extrusion Strip 6.4x6.4mm

www.lairdtech.com

EMI ESSENTIALSEMI ESSENTIALS

BOARD LEVEL SHIELDS

RECOVR

™

REMOVL

™

The ReMovl feature incorporates the ReCovr attachment mechanism applied to the pickup bridge of a BLS frame to allow for easy,

tool less detachment of the bridge after the frame is soldered to the PCB. Ease of detachment along with reliable and consistent

separation force will allow for automated detachment.

Note: Due to delicate nature of the attachment of the pickup bridge, there will be some risk to the bridge separating during pick and

place operations depending on customer manufacturing processes. Pick and place head depth tolerance (z axis) -.020”

The proprietary and patented ReCovr

™

product line incorporates the functionality of a two-piece shield without the need for a separate

frame and cover. The shield is specially designed with a locking mechanism that allows for easy removal of the shield cover when access

to board-level components is required. The locking mechanism makes repair of components under the shield quick and easy by eliminating

the need for removing the entire shield and reducing board re-work. The removable top shield also integrates Laird patented rigid corner

board-level shield technology, which incorporates a new corner design that optimizes component rigidity for increased part

and printed circuit board (PCB) firmness.

FEATURES

• Single-piece board-level shield with a removable

top cover

• Eave-less side walls when the cover is removed

• SMT or through-hole pin configurations available

• U.S. Patent No. 7504592

• Other characteristics typical to one-piece shields: vent

hole patterns, castellations, trace clearance notches, etc.

BENEFITS

• Eliminates need for replacement covers

• Offered as an assembled product only: tape and reel,

tray pack, or layer pack

• Excellent for periodic testing or rework applications.

• Limited footprint congurations (L-shapes, etc)

• Available in select Laird standard board-level sizes or

custom congurations

MARKETS OR APPLICATIONS

• Computing

• Telecommunications / Datacom

• Automotive

• Consumer Electronics

• SMART Metering

• Aerospace / Defense

• Medical

• Industrial & Instrumentation

FEATURES

• Detachment is permanent – cannot be replaced like

ReCovr

• Min Height: 2.0 mm (.080”) Lower heights required

Product Development Review

• Top Flange Width: 1.8 mm (.071”)

• Flatness: Part Size Dependent, but typical to other

Frame BLS parts

• Congurations Min 4 legs/branches required

(see BLS Style options)

• Limitations: Must be folded or rigid corner type BLS.

(No fully drawn parts.)

• Pull Force (Typ) 0.5 – 1.0 lbs

MARKETS

• Ideal for customer manufacturing processes where

post reow detachment of the pickup bridge is required or

desired. Applications that often require the bridge to

be detached include:

– Inspection

– Rework

– TIM Assembly into cover

– Cover with contact ngers to chip, etc.

– Noise / Vibration concerns of bridge to cover

2.200

TYP

.087

6.000

.236

2.550

TYP

.100

3.000

TYP

.118

3.000

TYP

.118

0.100 [.0039]

ALL SURFACES

25.400

1.000

38.100

1.500

4.05

.159

5.00

TYP

.197

2.70

.106

5.00

TYP

.197

2.36

TYP

.093

REMOVABLE LID AFTER

SOLDER TO BOARD

2.41

.095

R0.9

.033

2.41

.095

2.35

.093

DETAIL E

SCALE 10 : 1

DETAIL F

SCALE 10 : 1

RECOVR SCORE LINE

MAXIMUM SHEAR REQUIRED

NOTE: CRITICAL DIMENSIONS ARE DESIGNATED BY

REVISIONS

REV.

DESCRIPTION

DATE

APPROVED

INITAL RELEASE

06/28/2010

This 2d drawing is generated

from a 3d solid model. Refer

to 3d model for any dimensions

not shown on this drawing. 3d

model dimensions will always

take precedent over drawing

dimensions.

Block tolerances apply to

metric units only. Dual

dimensions shown are for

reference only and are

displayed in 3 places for

conversion purposes only.

STD PART REFERENCE:

PRODUCTION DRAWING

CONTROLLED DOCUMENT

1008/1010 CRS

FULL HARD TEMPER

INFORMATION CONTAINED IN THIS DOCUMENT IS CONFIDENTIAL

AND PROPRIETARY TO LAIRD TECHNOLOGIES. IT MAY NOT BE

DISCLOSED TO ANYONE WITHOUT WRITTEN AUTHORIZATION FROM

LAIRD TECHNOLOGIES

CAD MAINTAINED

DRAWING. MANUAL

CHANGES UNAUTHORIZED

MATERIAL:

REV:

UNITS: MM (INCH)

DATE:

06/28/2010

DESIGNED IN SOLIDWORKS

3RD ANGLE

PROJECTION

.X =

.XX =

.XXX =

X.X

3.0

X.XX

1.0

ANGULAR:

SIZE

SCALE: 2:1

TOLERANCES:

SHEET 1 OF 2

BMI-S-305

YES

ROHS COMPLAINT: (BASE PART)

1.25-5.00 MICRONS THICK

100% MATTE TIN

FINISH:

THICKNESS:)

0.25 0.020

[.0100

.0008]

PART NUMBER :

BMIS-105

MODEL/DRAWN BY:

MFMF

APPROVED BY:

2.200

TYP

.087

6.000

.236

2.550

TYP

.100

3.000

TYP

.118

3.000

TYP

.118

0.100 [.0039]

ALL SURFACES

25.400

1.000

38.100

1.500

4.05

.159

5.00

TYP

.197

2.70

.106

5.00

TYP

.197

2.36

TYP

.093

REMOVABLE LID AFTER

SOLDER TO BOARD

2.41

.095

R0.9

.033

2.41

.095

2.35

.093

DETAIL E

SCALE 10 : 1

DETAIL F

SCALE 10 : 1

RECOVR SCORE LINE

MAXIMUM SHEAR REQUIRED

NOTE: CRITICAL DIMENSIONS ARE DESIGNATED BY

REVISIONS

REV.

DESCRIPTION

DATE

APPROVED

INITAL RELEASE

06/28/2010

This 2d drawing is generated

from a 3d solid model. Refer

to 3d model for any dimensions

not shown on this drawing. 3d

model dimensions will always

take precedent over drawing

dimensions.

Block tolerances apply to

metric units only. Dual

dimensions shown are for

reference only and are

displayed in 3 places for

conversion purposes only.

STD PART REFERENCE:

PRODUCTION DRAWING

CONTROLLED DOCUMENT

1008/1010 CRS

FULL HARD TEMPER

INFORMATION CONTAINED IN THIS DOCUMENT IS CONFIDENTIAL

AND PROPRIETARY TO LAIRD TECHNOLOGIES. IT MAY NOT BE

DISCLOSED TO ANYONE WITHOUT WRITTEN AUTHORIZATION FROM

LAIRD TECHNOLOGIES

CAD MAINTAINED

DRAWING. MANUAL

CHANGES UNAUTHORIZED

MATERIAL:

REV:

UNITS: MM (INCH)

DATE:

06/28/2010

DESIGNED IN SOLIDWORKS

3RD ANGLE

PROJECTION

.X =

.XX =

.XXX =

X.X

3.0

X.XX

1.0

ANGULAR:

SIZE

SCALE: 2:1

TOLERANCES:

SHEET 1 OF 2

BMI-S-305

YES

ROHS COMPLAINT: (BASE PART)

1.25-5.00 MICRONS THICK

100% MATTE TIN

FINISH:

THICKNESS:)

0.25 0.020

[.0100

.0008]

PART NUMBER :

BMIS-105

MODEL/DRAWN BY:

MFMF

APPROVED BY:

INTRODUCTION

The complexities of today's electronics pose several design challenges.

Resolving EMI needs to be balanced with space, weight and production

restraints. When designing a custom shielding solution, beginning in the

earliest stages of the application design allows effective elimination of EMI

while meeting all specifications.

Laird board level shielding experts work through all phases of

development. From design, rapid prototyping and pre-production through

production and automated packaging, Laird has the experience to help speed

a product to market and stay within budget.

To increase manufacturing throughout and reduce costs, Laird has developed

a proprietary in-line production process that includes part

formation, wash, assembly, inspection and automated packaging.

By integrating quality processes, board level shield quality and performance is

ensured from design stage through final packaging. One process is the auto-

mated co-planarity inspection system. Laird replicates

the customer application

by measuring shields in the same

plane as the printed circuit board. This is

accomplished without "securing" or "touching" shields, which could

throw

off measurement and/or deform parts.

Laird

measures

shields immediately

prior to placement into carrier tape at speeds that match automation packing.

Shield base materials include our exclusive Shield-Lite

, CRS 1008/1010,

beryllium copper alloys, nickel-silver alloys, copper-based alloys and spring

steels. All shields are fully solderable.

ONE-PIECE SHIELD DESIGN

LOW COST/EXCELLENT EFFECTIVENESS

Custom surface mount shields are available in both one-piece and

two-piece designs. One-piece shields provide six sides of protection,

with the sixth side being the board itself. One-piece designs offer

economical shielding alternatives where access to covered components for

repair is not necessary.

TWO-PIECE SHIELD DESIGN

QUICK, EASY REPAIR AND INSPECTION OF COVERED

COMPONENTS

Two-piece board level shields offer users the flexibility to inspect or repair

shielded components without having to

risk board damage by removing

the entire shield. Covers

snap on and off with ease, making repairs quicker

and easier, and reducing board re-work. Two-piece shields are available

pre-assembled or unassembled. Large locking dimples snap into slots on

covers to provide mechanical retention force. Smaller grounding

dimples

provide electrical grounding for proper shielding

and to prevent rattle.

Two-piece shields survive drop, shock and no-rattle tests. Here are critical

test results:

• Able to withstand acceleration of 4g from 10 Hz to 2000 Hz for three

hours in each of three planes as per SAE J1455

• Pass EN 50 155 for railway electrical equipment including vibration test

of 30g from 5 Hz to 200 Hz

in 3 directions and a shock test with 500 m/s

for 11/ms

• Pass standard telecommunications drop tests [6 faces, dropped 1 meter

onto concrete floor]

*Other materials may be available, please consult sales.

Note: Co-planarity dependant on design

SURFACE MOUNT SHIELDS MATERIAL VARIATIONS

RAW MATERIAL*

THICKNESS

in (mm)

COMMENTS

Cold Rolled Steel

1008/1010

0.005 to 0.090 (0,127

to 2,286)

Pre-plated Tin

Nickel-silver alloys

0.004 to 0.016

(0,102 to 0,406)

No plating required

for SMT

solderability

Phosphor Bronze alloys

0.004 to 0.020

(0,100 to 0,510)

Pre-tempered & Preplated

Notice: The data set forth in all text, tables, charts, graphs and figures herein are based on samples tested and are

not guaranteed for all samples or applications. Such data are intended as guides and do not reflect product

specification for any specific part. Material properties are for reference only. Product testing by purchaser is recommended to

confirm. Laird assumes no liability for product failure unless specifically stated in writing.

BOARD LEVEL SHIELDS

DRAWN BOARD LEVEL SHIELDS

SEAMLESS CORNERS ADDRESS HIGH-FREQUENCY LEAKAGE

As microprocessor speeds continue to increase, so does the potential for EMI

leakage through the smallest

apertures in board level shields. Laird

drawn board

level shields are designed to provide additional near-field and far-field circuit

isolation (attenuation) at higher frequencies by eliminating the apertures found

in the corners of traditional board level solutions. Drawn board level shields

utilize small ground trace sizes, thereby preserving space on the circuit board.

• Solid corner designs when additional circuit isolation (attenuation) is

required at higher frequencies

• Available in custom heights up to .250" (6,4 mm) with length and width

dimensions from .300" (7,6 mm) to 2.0" (50,8 mm)

• Tape and reel packaging provides an economical and automated SMT

attachment method

• Available in cold rolled steel, brass, stainless steel and nickel silver

• Molded Compartment Shields and Form-In-Place elastomers can be

combined with drawn board level shields to achieve shielding of

multiple components with a single part

• Available with an EZ Peel scored cover feature; allows for easy top

section removal for component repair and re-sealing

• Ventilation holes as needed for solder outgassing.

• Online shielding effectiveness calculator

Series 97-2100

MULTI-COMPARTMENTAL SHIELD DESIGN

SHIELD MULTIPLE CIRCUIT GROUPS SAVE PCB SPACE AND PRODUCTION

TIME

Multi-compartmental shields feature internal dividing walls of one material

thickness and meet all on-board shield requirements for FCC, VDE, CISPR

and CE. These shields are available in two-piece designs, either assembled

or unassembled. Our unassembled versions allow for automatic optical

inspection prior to cover placement. As in all our shielding offerings,

Laird proprietary process for 100% automatic optical

inspection verifies co-planarity including inner walls.