Datasheet

Tflex 600 Series
Thermal Gap Filler
Americas: +1.866.928.8181
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
*Ready for 5G
Product Description
Tflex
TM
600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal
conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron
nitride filler in the composition.
The high conductivity, in combination with extreme softness produces incredibly low thermal
resistances.
Tflex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal
performance. Tflex 600 is electrically insulating, stable from –45°C to 200°C and meets UL 94 V0
rating.
FEATURES AND BENEFITS
• Very high compliancy for low stress applications
• 3 W/mK thermal conductivity
• Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm)
• Naturally tacky, needs no further adhesive coating
SPECIFICATIONS
TYPICAL PROPERTIES VALUE TEST METHOD
Construction & Composition Ceramic filled silicone sheet N/A
Color Blue-Viloet Visual
Thickness Range 0.50mm (0.020”) - 5.08mm (0.20”) N/A
Thermal Conductivity (W/mK) 3.0 ASTM D5470
Density (g/cc) 1.34 Helium Pyncometer
Hardness (Shore 00) 51 ASTM D2240
Outgassing TML (weight %) 0.13 ASTM E595
Outgassing CVCM (weight %) 0.05 ASTM E595
Temperature Range -45°C to 200°C N/A
Rth@ 40 mils, 10 psi, 50
0
C 0.62°C–in2/W ASTM D5470
(modified)
Dielectric Constant @ 10GHz 4.0 ASTM D150
UL Flammability Rating V-0 UL 94
Volume Resistivity (ohm-cm) 2 x 10^13 ASTM D257