Datasheet

global solutions: local support
TM
Innovative Technology
for a Connected World
Tflex
TM
500 Series
Thermal Gap Filler
COMPLIANT 2.8 W/mK THERMALLY CONDUCTIVE GAP FILLER
Tex
™
500 is a compliant elastomer gap ller designed to provide excellent thermal
performance while remaining cost effective. This soft interface pad conforms well with
minimal pressure, resulting in little or no stress on mating parts. Tex
™
500’s unique
silicone and ller combination has extremely low silicone extractables compared to many
other silicone interface products. Tex
™
500 meets NASA outgassing specication.
Tex
™
500 is naturally tacky, no adhesive coating is required. Tex
™
500 is electrically
insulating, stable from -50ºC to 200ºC and is certied to UL 94V0 ammability rating.
FEATURES AND BENEFITS
• Thermal conductivity 2.8 W/mK
• Highly compliant and cost effective
• Low thermal resistance even at low pressure
• Available in thicknesses from 0.020-inch (0.25mm) through
0.200-inch (5.0mm) in 0.010-inch increments
• Naturally tacky for easy assembly
• Low silicone extractables
APPLICATIONS
• Cooling components to chassis
• Telecommunication hardware
• Thermal module for notebook computer
• LED solid state lighting
• Power electronics
• Computer servers
• Graphics cards
• Gaming systems
• LCD and PDP at panel displays
• Industrial automation equipment
• Wireless infrastructure
• Fragile ASIC components
• Automotive engine control
• IT devices
• Military electronics
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
[e-mail]
www.lairdtech.com/thermal