Datasheet

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TM
Innovative Technology
for a Connected World
Tflex
TM
300TG Series
Thermal Gap Filler
UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE
The high rate of compliancy of Tex™ 300TG allows the material to “totally blanket”
the component, enhancing thermal transfer. The material has a very low compression
set enabling the pad to be reused many times. Tex™ 300TG, in achieving its stellar
compliancy, does not sacrice thermal performance. With a thermal conductivity of
1.2 W/mK, low thermal resistance can be achieved at low pressures.
A Tgard™ silicone liner has been added to the Tex™ 300TG to offer a guaranteed
dielectric barrier. The Tgard™ is cut-through resistant and provides easier part handling
in mass production.
FEATURES AND BENEFITS
• Extreme compliancy allows material to “totally blanket” component(s)
• Thermal conductivity of 1.2 W/mK
• Provides a dielectric barrier
• Low compression set enables the pad to be reused many times
APPLICATIONS
• Notebook and desktop computers
• Telecommunication hardware
• Flat panel displays
• Memory modules
• Power conversion equipment
• Set top box
• Lighting ballast
• Automotive electronics
• LED lighting
• Handheld electronics
• Optical disk drives
• Vibration dampening
Americas: +1.888.246.9050
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
[e-mail]
www.lairdtech.com/thermal