Datasheet

global solutions: local support
TM
Innovative Technology
for a Connected World
Tflex
TM
300 Series
Thermal Gap Filler
UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE
Tex™ 300, at pressures of 50psi, will deect to over 50% the original thickness. This high
rate of compliancy allows the material to “totally blanket” the component, enhancing
thermal transfer. The material has a very low compression set enabling the pad to be reused
many times.
Tex™ 300, in achieving its stellar compliancy, does not sacrice thermal performance. With
a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pres-
sures.
Tex™ 300-H is offered with a hard, metallized liner option for easy handling and improved
rework. The metallized liner’s lower coefcient of friction also allows for easy assembly of
parts that must slide together, such as a card into a chassis.
Tex™ 300-TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner
offers a guaranteed dielectric barrier, and easier part handling for mass production.
FEATURES AND BENEFITS
• Extreme compliancy allows material to “totally blanket” component(s)
• Thermal conductivity of 1.2 W/mK
• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
• Low compression set enables the pad to be reused many times
APPLICATIONS
• Notebook and desktop computers
• Telecommunication hardware
• Flat panel displays
• Memory modules
• Power conversion equipment
• Set top box
• Lighting ballast
• Automotive electronics
• LED lighting
• Handheld electronics
• Optical disk drives
• Vibration dampening
Americas: +1.888.246.9050
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
[e-mail]
www.lairdtech.com/thermal