Brochure

Thermally Conductive Printed
Circuit Board
(Tlam
TM
and Tpreg
TM
)
Tlam thermally conductive circuit boards are designed with Laird’s
unique dielectric materials 1KA and HTD. Tlam technology improves
thermal performance while retaining good dielectric isolation.
The 1KA material offers high thermal conductivity for applications
where a thick dielectric is required. The 1KA material is available as a
freestanding Tpreg to facilitate multilayer and FR4 hybrid circuit boards.
The HTD material is used where high withstand voltage
(>5000 V DC) and continuous use temperature of 150°C are
required.
APPLICATIONS
• LED lighting – architectural lighting and street/highway/
parking/signal lighting
• Telecom – DC/DC convertors and base stations
• Automotive – motor control systems, power steering
modules, ABS braking systems, headlights, brake lights,
and daytime running lights
• Consumer – LCD LED backlighting units
• Industrial – solar voltaic, industrial voltage regulators,
and power supplies
Graphite Materials (Tgon
TM
)
Tgon 800 is a high-performance, cost-effective TIM that can be
used where electrical isolation is not required. Tgon 800’s unique
grain oriented graphite plate structure provides 5 W/mK through the
Z axis.
Tgon 9000 is ultra-thin, light-weight, flexible and offers excellent in-
plane thermal conductivity. Ideal for a variety of heat spreading
applications where in-plane thermal conductivity dominates and
limited space.
APPLICATIONS
• Handheld devices
• Mobile computing
• Display
• Lighting
• Power conversion equipment
• Power supplies
• Large telecommunications switching hardware
• Where electrical grounding is required with good
thermal conductivity
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