Datasheet

global solutions:
local support
TM
SUFFIX THICKNESS
(PRIOR TO TINNING)
FLATNESS &
PARALLELISM
HOT
FACE
COLD
FACE
Lead
Length
L 0.126”± 0.010” 0.0015” / 0.0015” Lapped Lapped 4.5”
L1 0.126”± 0.001” 0.001” / 0.001” Lapped Lapped 4.5”
L2 0.126”± 0.0005” 0.0005” / 0.0005” Lapped Lapped 4.5”
ML 0.130”± 0.010” 0.002” / 0.002” Metallized Lapped 4.5”
LM 0.130”± 0.010” 0.002” / 0.002” Lapped Metallized 4.5”
MM 0.134”± 0.010” 0.002” / 0.002” Metallized Metallized 4.5”
SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION
RT RTV White -60 to 204 °C Non-corrosive, silicone adhesive sealant
EP Epoxy Black -55 to 150 °C Low density syntactic foam epoxy encapsulant
Innovative Technology
for a Connected World
Ceramic Plate Series CP10,127,05
Thermoelectric Modules
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
clv.customerpos@lairdtech.com
www.lairdtech.com
FEATURES
• PreciseTemperatureControl
• CompactGeometricSizes
• ReliableSolidStateOperation
• NoSoundorVibration
• EnvironmentallyFriendly
• DCOperation
• RoHSCompliant
APPLICATIONS
• MedicalLasers
• LabScienceInstrumentation
• ClinicalDiagnosticSystems
• PhotonicsLaserSystems
• ElectronicEnclosureCooling
• Food&BeverageCooling
• Chillers(LiquidCooling)
TheCeramicPlate(CP)SeriesofThermoelectricModules(TEMs)isconsidered
‘thestandard’inthethermoelectricindustry.
Thisbroadproductlineofhigh-performanceandhighlyreliableTEMsisavailable
innumerousheatpumpingcapacities,geometricshapes,andinputpowerranges.
AssembledwithBismuthTelluridesemiconductormaterialandthermallyconductive
AluminumOxideceramics,theCPSeriesisdesignedforhighercurrentandlarge
heat-pumpingapplications.
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C) 25°C 50°C
Qmax (Watts) 34.3 39.1
Delta Tmax (°C) 67 75
Imax (Amps) 3.9 3.9
Vmax (Volts) 14.4 16.4
Module Resistance (Ohms) 3.36 3.78
SEALING OPTION

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