Datasheet
global solutions:
local support
TM
SUFFIX THICKNESS
(PRIOR TO TINNING)
FLATNESS &
PARALLELISM
HOT
FACE
COLD
FACE
Lead
Length
L 0.150”± 0.010” 0.002” / 0.002” Lapped Lapped 4.5”
L1 0.150”± 0.001” 0.001” / 0.001” Lapped Lapped 4.5”
L2 0.150”± 0.0005” 0.0005” / 0.0005” Lapped Lapped 4.5”
ML 0.154”± 0.010” 0.002” / 0.002” Metallized Lapped 4.5”
LM 0.154”± 0.010” 0.002” / 0.002” Lapped Metallized 4.5”
MM 0.158”± 0.010” 0.002” / 0.002” Metallized Metallized 4.5”
SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION
RT RTV White -60 to 204 °C Non-corrosive, silicone adhesive sealant
EP Epoxy Black -55 to 150 °C Low density syntactic foam epoxy encapsulant
Innovative Technology
for a Connected World
Ceramic Plate Series CP14,127,06
Thermoelectric Modules
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
clv.customerpos@lairdtech.com
www.lairdtech.com
FEATURES
• PreciseTemperatureControl
• CompactGeometricSizes
• ReliableSolidStateOperation
• NoSoundorVibration
• EnvironmentallyFriendly
• DCOperation
• RoHSCompliant
APPLICATIONS
• MedicalLasers
• LabScienceInstrumentation
• ClinicalDiagnosticSystems
• PhotonicsLaserSystems
• ElectronicEnclosureCooling
• Food&BeverageCooling
• Chillers(LiquidCooling)
TheCeramicPlate(CP)SeriesofThermoelectricModules(TEMs)isconsidered
‘thestandard’inthethermoelectricindustry.
Thisbroadproductlineofhigh-performanceandhighlyreliableTEMsisavailable
innumerousheatpumpingcapacities,geometricshapes,andinputpowerranges.
AssembledwithBismuthTelluridesemiconductormaterialandthermallyconductive
AluminumOxideceramics,theCPSeriesisdesignedforhighercurrentandlarge
heat-pumpingapplications.
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C) 25°C 50°C
Qmax (Watts) 51.4 56.2
Delta Tmax (°C) 67 75
Imax (Amps) 6.0 6.0
Vmax (Volts) 14.5 16.4
Module Resistance (Ohms) 2.25 2.53
SEALING OPTION