EM7411 Product Technical Specification 41113694 Rev 5 Proprietary and Confidential Contents subject to change
Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Lantronix, Inc. product are used in a normal manner with a well-constructed network, the Lantronix, Inc.
Preface Patents This product may contain technology developed by or for Lantronix, Inc. Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Lantronix, Inc. Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing. Copyright ©2021 Lantronix, Inc.. All rights reserved. Trademarks Lantronix, Inc.®, AirPrime®, AirLink®, AirVantage® and the Lantronix, Inc.
Contents Introduction........................................................................................................................ 11 Supported RF bands ...................................................................................................... 11 Physical Features ........................................................................................................... 13 Application Interface Features ..................................................................................
Contents RF Specifications .............................................................................................................. 36 RF Connections ............................................................................................................. 36 Shielding .................................................................................................................. 36 Antenna and Cabling ..............................................................................................
Product Technical Specification Mechanical and Environmental Specifications............................................................... 54 Electrostatic Discharge (ESD) ....................................................................................... 55 Thermal Considerations................................................................................................. 55 Module Integration Testing ............................................................................................
Contents IOT/Operator Testing..................................................................................................... 79 Extended AT Commands for Testing ............................................................................. 80 Packaging .......................................................................................................................... 81 References ....................................................................................................................
List of Tables Table 1-1: Supported RF Bands .......................................................................................... 11 Table 1-2: Carrier Aggregation Downlink Combinations ...................................................... 11 Table 1-3: Carrier Aggregation Uplink Combinations ........................................................... 12 Table 1-4: Required Host-Module Connectors.....................................................................
Contents Table 6-1: Mechanical and Environmental Specifications ................................................... 54 Table 7-1: Standards Compliance....................................................................................... 57 Table 7-2: Antenna Gain and Collocated Radio Transmitter Specifications ........................ 58 Table A-1: Antenna Requirements ...................................................................................... 60 Table A-2: GNSS Antenna Requirements ...........
List of Figures Figure 2-1: System Block Diagram ....................................................................................... 18 Figure 2-2: Expanded RF (Transmit) Block Diagram ........................................................... 19 Figure 2-3: Expanded RF (Receive/GNSS) Block Diagram ................................................ 20 Figure 2-4: Recommended Capacitor Placement for USB3.0 Signals .................................
1 1: Introduction The Lantronix, Inc. EM7411 Embedded Module is an M.2 module that provides LTE, UMTS, and GNSS connectivity for notebook, ultrabook, tablet computers, and M2M applications over several radio frequency bands. Supported RF bands The module, based on Qualcomm's MDM9250 baseband processor, supports data operation on LTE and UMTS networks over the bands described in Table 1-1, with LTE carrier aggregation (CA) as described in Table 1-2 and Table 1-3.
Product Technical Specification Table 1-2: Carrier Aggregation Downlink Combinations (Continued) 1 Band / 2CC 2 Bands / 2CC CA_4A-4A CA_4A-5A CA_4A-7A CA_4A-12A CA_4A-13A CA_4A-71A CA_5B CA_5A-66A CA_7A-7A CA_7A-12A CA_7B CA_7C CA_12B CA_12A-66A CA_13A-66A CA_14A-66A CA_25A-25A CA_25A-26A CA_26A-41A CA_41A-41A CA_41C CA_42A-42A CA_42C CA_43C CA_48A-48A CA_48C CA_66A-66A CA_66A-71A CA_66B CA_66C Table 1-3: Carrier Aggregation Uplink Combinations CA_5B CA_7C CA_41C CA_42C CA_43C CA_48C Rev 5 M
Introduction Physical Features • • M.2 form factor—WWAN Type 3042-S3-B (in WWAN—USB 3.0 Port Configuration 2), as specified in [8] PCI Express NGFF (M.2) Electromechanical Specification Revision 1.0. (Note: Any variations from the specification are detailed in this document.
Product Technical Specification • • PDP context type (IPv4, IPv6, or IPv4v6) RFC1144 TCP/IP header compression LTE Features • · • • • • • • • • • • • • Carrier aggregation: · DL LTE-FDD— 40 MHz · DL LTE-TDD— 40 MHz UL LTE— 40 MHz intraband contiguous CSG support (LTE Femto) LTE Advanced receivers (NLIC, eICIC, feICIC) Basic cell selection and system acquisition · PSS/SSS/MIB decode · SIB1–SIB16 decoding NAS/AS security procedures · Snow 3G/AES/ZUC security CQI/RI/PMI reporting Paging procedures · Pagin
Introduction Supporting Documents Several additional documents describe module design, usage, integration, and other features. See References on page 83. Accessories A hardware development kit is available for AirPrime M.2 modules. The kit contains hardware components for evaluating and developing with the module, including: • Development board • Cables • Antennas • Other accessories For over-the-air LTE testing, ensure that suitable antennas are used.
Product Technical Specification • • • • • • • Rev 5 May.21 Mounting—Effect on temperature, shock, and vibration performance Power supply— Impact on battery drain and possible RF interference Antenna location and type—Impact on RF performance Regulatory approvals —As discussed in Regulatory Compliance and Industry Certifica- tions on page 57. Service provisioning —Manufacturing process Software —As discussed in Software Interface on page 53.
2 2: Electrical Specifications The system block diagram in Figure 2-1 represents the EM7411 module integrated into a host system. The module includes the following interfaces to the host: • Full_Card_Power_Off#— Input supplied to the module by the host— active-low to turn the unit off, or active-high to turn the unit on. • W_DISABLE1#— Active low input from the host to the EM7411 disables the main RF radio. • W_DISABLE2#— Active low input from the host to the EM7411 disables the GNSS radio receiver.
Product Technical Specification RF BLOCK APT GPS PWR RF + GRFC_GPIO Voltage Supply SPMI External NAND and RAM 4GB NAND 2GB RAM SIM_DETECT NAND USIM1 PDM9655 SIM_DETECT_2 USIM2 DDR2 DRAM MDM9250 WAKE_ON_WAN# W_DISABLE1# W_DISABLE2# DPR ANTCTL0 (GPIO1) ANTCTL1 (GPIO2) ANTCTL3 (GPIO3) USB3.0 USB2.0 ANTCTL4 (GPIO4) HOST INTERFACE CONNECTOR VPH/ VBAT VCC RESET# WWAN_LED Full_Card_Power_Off# SIM SUPPLY 2.7 / 1.8 V Figure 2-1: System Block Diagram Rev 5 May.
Electrical Specifications QLN1030_PRX UHB_IN MB_IN2 B42/ B43/ B48 B42/B43/B48 MLB_IN2 HB1_IN1 B41 HB2_IN2 B7 B4/B66 MB2_IN1 B2/ B25 MB2_IN2 PRX_UHB_LTEU_A UHB_AUX_OUT1 PRX_UHB_LTEU_B UHB_AUX_OUT2 PRX_LHB HB_AUX_OUT PRX_HB HUHB_OUT PRX_MB_B MHUHB_OUT PRX_MB_A MLMHB_OUT SWITCH WTR5975 HB1_IN2 MB1_IN1 B41 B41 B7 B7 B41 LHB_LB_IN B7 SWITCH B4/ 66 B4/66 B4/B66 B2/B25 B2/ B25 SW TX_CH1_UHB TX_CH0_H B2 TX_CH0_MB1 B2/B25 B5B 18 B19B 26 B14/B28 B13 B13 B71 B13 B71 QLN1020_P
Product Technical Specification WTR5975 QLN1020_DRX DRX_LB OUT1 OUT2 LB_SW12 B14 LB_SW11 B13 LB_SW23 B5/ B26 LB_SW15 B14 B14 B13 B13 B5/B26 B5/ B26 B12 B12 B12 B71 LB_SW14 B71 LPF B71 GNSS_IN GNSS LNA GNSS QLN1030_DRX LHB_LB_IN MB1_IN1 B4/ B66 MB2_IN2 B2/B25 HB1_IN1 B7 B4/B66 B2/B25 B7 B4/B66 B2/B25 B7 MLB_IN2 B41 HB2_IN2 HB1_IN2 UHB_IN DRX_UHB_LTEU_A UHB_AUX_OUT1 DRX_UHB_LTEU_B UHB_AUX_OUT2 DRX_LHB HB_AUX_OUT DRX_HB HUH B_OUT DRX_MB_B MHUHB_OUT DRX_MB_A MLMHB_O
Electrical Specifications Table 2-1: Host Interface (75-pin) Connections — Module Viewa Pin Signal name Pin type b Description Voltage levels (V) Active state Directionc Min Typ Max 1 CONFIG_3 (NC in default module configuration) 2 VCC V Power source Input Power 3.135 3.7 4.4 3 GND V Ground Input Power - 0 - 4 VCC V Power source Input Power 3.135 3.7 4.4 5 GND V Ground Input Power - 0 - 6 Full_Card_Power_Off#d PD Turn module on Input High 0.7 - 4.
Product Technical Specification Table 2-1: Host Interface (75-pin) Connections — Module Viewa (Continued) Pin 26 Signal name W_DISABLE2#e Pin type b PU Directionc Voltage levels (V) Active state Min Typ Max Wireless disable (GNSS radio) Input Low - - 0.4 Input High 0.7 - 4.4 Ground Input Power - 0 - 27 GND 28 NC Reserved—Host must not repurpose this pin. 29 USB3.0_TX- USB 3.
Electrical Specifications Table 2-1: Host Interface (75-pin) Connections — Module Viewa (Continued) Pin Signal name Pin type b Description 40 SIM_DETECT_2 SIM2 indication 41 NC Reserved 42 UIM2_DATAd - SIM2 IO pin Directionc Input Input Voltage levels (V) Active state Min Typ Max 0 V—SIM not present Open circuit—SIM present Low -0.30 (3V SIM) 0.60 (3V SIM) - 0.35 (1.8V SIM) -0.30 (1.8V SIM) 2.10 (3V SIM) 3.00 (3V SIM) 3.30 (3V SIM) 1.17 (1.8V SIM) 1.80 (1.8V SIM) 2.10 (1.
Product Technical Specification Table 2-1: Host Interface (75-pin) Connections — Module Viewa (Continued) Pin Signal name Pin type b Description 56 NC 57 GND 58 NC Reserved—Host must not repurpose this pin. 59 ANTCTL0 (GPIO1) Customer-defined external switch control for multiple antennas Voltage levels (V) Active state Directionc Min Typ Max Reserved—Host must not repurpose this pin. V Ground Input Power - 0 - Output High 1.35 - 1.80 Output Low 0 - 0.
Electrical Specifications e. Lantronix, Inc. recommends that the host implement an open collector driver where a Low signal will turn the module off or enter low power mode, and a high signal will turn the module on or leave low power mode. Power Supply The host provides power to the EM7411 through multiple power and ground pins as summarized in Table 2-2.
Product Technical Specification Host-side Recommendation Note: When designing the host device, careful PCB layout practices must be followed. Lantronix, Inc. recommends the host platform include series capacitors on the USB3.0 Rx signals (no capacitors required for the Tx signals), as shown below. Host 35 100 nF 37 29 31 EDGE Connector 100 nF USB3.0-RX- RX USB3.0-RX+ USB3.0-TX- 100 nF USB3.0-TX+ 100 nF EM7411 TX Figure 2-4: Recommended Capacitor Placement for USB3.
Electrical Specifications The types of SIM connectors used depends on how the host device exposes the SIM sockets.
Product Technical Specification SIM Detect UIM-PWR 4.7uF X5R typ 0.1uF (Optional. Locate near the SIM socket) 15 kΩ - 30 kΩ NOTE: UIM signals refer to both UIM1 and UIM2. Located near SIM socket (C9) (Optional. Locate near the SIM socket) 47 pF, 51 Ω (C1) Note: SIM Detect contact may vary by vendor (C3) UIM-DATA (C7) UIM-RESET (C2) UIM_GND (C5) SIM card connector UIM-CLK EM7411 Located near SIM socket.
Electrical Specifications SIM Implementation Note: For interface design requirements, refer to ETSI TS 102 230 V5.5.0, section 5.2. When designing the remote SIM interface, you must make sure that SIM signal integrity is not compromised. Some design recommendations include: • Total impedance of the VCC and GND connections to the SIM, measured at the module connector, should be less than 1 Ω to minimize voltage drop (includes any trace impedance and lumped element components— inductors, filters, etc.).
Product Technical Specification Control Interface (Signals) The EM7411 provides signals for: • Waking the host when specific events occur • Host control of the module’s radios • Host control of module power • LED driver output Note: Host support for Full_Card_Power_Off# is required, and support for other signals in Table 2-5 is optional. These signals are summarized in Table 2-5 and paragraphs that follow.
Electrical Specifications VCC 5k-100k Host WAKE_ON_WAN# 3 1 Control Q R 2 Module Figure 2-7: Recommended WAKE_ON_WAN# Connection W_DISABLE1# (Wireless Disable) and W_DISABLE2# (GNSS Disable) Note: Host support for wireless/ GNSS disable signals is optional. The host device uses W_DISABLE1# to enable/ disable the WWAN or radio modem, and W_DISABLE2# to enable/disable GNSS functionality. Letting these signals float high allows the module to operate normally. These pins have 100 kΩ pull-up resistors.
Product Technical Specification VCC PMIC for W_DISABLE1# 100k Host Wireless disable control 10k 3 1 Q R 2 Module Figure 2-8: Recommended Wireless Disable Connection Full_Card_Power_Off# and RESET# Note: Host support for Full_Card_Power_Off# is required, and support for RESET# is optional. Full_Card_Power_Off# and RESET# are inputs to the module that the host uses as described in Table 2-7. For timing details, see Power On/Off Timing for the USB on page 50. Rev 5 May.
Electrical Specifications Table 2-7: Full_Card_Power_Off# and RESET# Usage Name Pin Full_Card_Power_Off# 6 Description / notes Powers the module on/off. • Signal is required. • Pull HIGH to keep the module on. To keep the module always on: · Tie the pin directly to a host GPIO (1.8V), or · Use an external pull-up to pull signal high (10–20k for 1.8V, 75–100k for VCC rail). Note that a larger-value resistor will reduce leakage current.
Product Technical Specification VCC Current limiting Resistor LED Module LED# MIO Figure 2-9: Example LED Tx Activity Indicator (TX_ON) The module provides a digital output signal to indicate the occurrence of Tx activity. Table 2-8: Tx Activity Indicator States Pin Signal name 61 Directiona TX_ON I/O type Output 1.8V Module state Signal State During Tx activity High No Tx Low a. Signal direction with respect to module—TX_ON (pin 5) is an output from the module to the host.
Electrical Specifications TX_ON V_APT Voltage Drop Tadvance Tde lay * V_APT – Internal power sou rce for RF PA Figure 2-10: TX_ON State During Transmission Antenna Control Note: Host support for antenna control signals is optional. The EM7411 provides four output signals (listed in Table 2-10) that may be used for host designs that incorporate tunable antennas. Customers can configure these signals as appropriate for the operating band(s) using the command AT!ANTSEL. Note: • Lantronix, Inc.
3 3: RF Specifications The EM7411 includes three RF connectors for use with host-supplied antennas: • Main RF connector—Tx/Rx path • GNSS RF connector—Dedicated GPS, GLONASS, BeiDou, Galileo, and QZSS • Auxiliary RF connector— Diversity, MIMO, GPS, GLONASS, BeiDou. Galileo, and QZSS The module does not have integrated antennas.
RF Specifications Antenna and Cabling When selecting the antenna and cable, it is critical to RF performance to match antenna gain and cable loss. Note: For detailed electrical performance criteria, see Appendix A: Antenna Specification on page 60. Choosing the Correct Antenna and Cabling When matching antennas and cabling: • The antenna (and associated circuitry) should have a nominal impedance of 50 Ω with a return loss of better than 10 dB across each frequency band of operation.
Product Technical Specification Important: LTE networks expect modules to have more than one antenna enabled for proper operation. Therefore, customers must not commercially deploy their systems with the diversity antenna disabled. Note: A diversity antenna is used to improve connection quality and reliability through redundancy. Because two antennas may experience difference interference effects (signal distortion, delay, etc.
RF Specifications The severity of this interference depends on the closeness of the other antennas to the module’s antenna. To determine suitable locations for each wireless device’s antenna, thoroughly evaluate your host device’s design. Host-generated RF Interference All electronic computing devices generate RF interference that can negatively affect the receive sensitivity of the module. Proximity of host electronics to the antenna in wireless devices can contribute to decreased Rx performance.
Product Technical Specification Radiated Sensitivity Measurement A wireless host device contains many noise sources that contribute to a reduction in Rx performance. To determine the extent of any receiver performance desensitization due to self-generated noise in the host device, over-the-air (OTA) or radiated testing is required. This testing can be performed by Lantronix, Inc. or you can use your own OTA test chamber for in-house testing. Lantronix, Inc.
RF Specifications Table 3-1: LTE Frequency Bands Band Frequency (Tx) Frequency (Rx) B2 1850–1910 MHz 1930–1990 MHz B4 1710–1755 MHz 2110–2155 MHz B5 824–849 MHz 869–894 MHz B7 2500–2570 MHz 2620–2690 MHz B12 699–716 MHz 729–746 MHz B13 777–787 MHz 746–756 MHz B14 788–798 MHz 758–768 MHz B25 1850–1915 MHz 1930–1995 MHz B26 814–849 MHz 859–894 MHz B41 2496–2690 MHz (TDD) B42 3400–3600 MHz (TDD) B43 3600–3800 MHz (TDD) B48 3550–3700 MHz (TDD) B66 1710–1780 MHz 2110–2200
Product Technical Specification Table 3-2: LTE Bandwidth Supporta (Continued) Band 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz B66 ✘ ✘ ✔ ✔ ✔ ✔ B71 ✘ ✘ ✔ ✔ ✔ ✔ a. Table contents are derived from 3GPP TS 36.521-1 v12.6.0, table 5.4.2.1-1. b. Bandwidth for which a relaxation of the specified UE receiver sensitivity requirement (Clause 7.3 of 3GPP TS 36.521-1 v12.6.0) is allowed. c.
RF Specifications Conducted Rx Sensitivity / Tx Power Note: Values in the following tables are preliminary, pending transceiver matching/testing. Table 3-4: Conducted Rx (Receive) Sensitivity — LTE Bandsa LTE bands Conducted Rx sensitivity (dBm) Primary (Typ) Secondary (Typ) SIMO (Typ) SIMOb (Worst case) B2 -97 -97 -99.5 -94.3 B4 -97 -97 -99.5 -96.3 B5 -98.5 -99 -101.5 -94.3 B7 -97.5 -96.5 -99 -94.3 B12 -100 -99 -102 -93.3 B13 -98.5 -99 -101.5 -93.3 -99.5 -99 -102.
Product Technical Specification Table 3-6: Conducted Tx (Transmit) Power Tolerancesa Bands Conducted Tx power Notes LTE ± 1 dB LTE bands 2, 4, 25, 26, 66 22.5 dBm LTE band 5 Single cell: 22.5 dBm ± 1 dB UL CA: 23.3 dBm ± 1 dB LTE bands 7, 41, 42, 43, 48 Single cell: 22 dBm ± 1 dB UL CA: 22.8 dBm ± 1 dB LTE bands 12, 13, 14, 71 23 dBm 0.8 dB offset for UL CA hardcoded by chipset manufacturer ± 1 dB UMTS Band 2 (UMTS 1900 12.2 kbps) 23 dBm ± 1 dB Band 4 (AWS 1700/2100 12.
RF Specifications d. Acquisition sensitivity is the lowest GNSS signal level for which the device can still detect an in-view satellite 50% of the time. The module includes an internal GNSS LNA. Rev 5 May.
4 4: Power Power Consumption Power consumption measurements in the tables below are for the EM7411 connected to the host PC via USB. The module does not have its own power source and depends on the host device for power. For a description of input voltage requirements, see Power Supply on page 25. Table 4-1: Averaged Standby DC Power Consumption Bandsa Current Signal Description VCC Standby current consumption (Sleep mode activatedb) Typ Unit Notes / configuration LTE LTE bands 1.
Power Table 4-2: Averaged Call Mode DC Power Consumption a Description Currentb Tx power Unit 460 mA CA 300/150 Mbps, 20 MHz+20 MHz BW 330 mA CA 100/25 Mbps, 10 MHz+10 MHz BW 260 mA 150/50 Mbps, 20 MHz BW 950 mA CA 300/150 Mbps, 20 MHz+20 MHz BW 690 mA CA 100/25 Mbps, 10 MHz+10 MHz BW 820 mA 150/50 Mbps, 20 MHz BW 0 dBm 200 mA All speeds Max Tx power 520 mA All speeds 1.31 A 0 dBm LTE Max Tx power DC-HSPA/HSPA Notes Typ Peak current All LTE/WCDMA bands a.
Product Technical Specification Module Power States The module has five power states, as described in Table 4-4. • • Module is active • Module is capable of placing/receiving calls, or establishing data connections on the wireless network • Low power (‘Airplane mode’) • • Radio enabled Normal (Default state) Details USB interface active State Host is powered Table 4-4: Module Power States ✔ ✔ ✔ ✔ ✔ ✘ ✔ ✘a ✘ ✔ ✘a ✘ ✘ ✘b ✘ Default state.
Power Power State Transitions The module uses state machines to monitor supply voltage and operating temperature, and notifies the host when critical threshold limits are exceeded. (See Table 4-5 for trigger details and Figure 4-1 for state machine behavior.) Power state transitions may occur: • Automatically, when critical supply voltage or module temperature trigger levels are encountered.
Product Technical Specification Power Interface Power Ramp-up On initial power up, inrush current depends on the power supply rise time— turn on time >100 µs is required for < 3A inrush current. The supply voltage must remain within specified tolerances while this is occurring. Timing Power On/Off Timing for the USB Figure 4-2 describes the timing sequence for powering the module on and off.
Power Table 4-6: USB 2.0 Power-On / Off Timing Parameters (Double Enumeration) Parameter Typical (s) Maximum (s) t_pwr_on_seq 0.8 0.9 t_USB_active 0.12 0.2 t_USB_suspend 8.5 11 t_pwr_off_seq 21.4 25 Table 4-7: USB 2.0 Power-On / Off Timing Parameters (Single Enumeration) Parameter Typical (s) Maximum (s) t_pwr_on_seq 8.7 11 t_pwr_off_seq 21.4 25 Table 4-8: USB 3.0 Power-On / Off Timing Parameters (Single Enumeration) Parameter Typical (s) Maximum (s) t_pwr_on_seq 8.
Product Technical Specification Power Supply Noise Noise in the power supply can lead to noise in the RF signal. The power supply ripple limit for the module is no more than 100 mVp-p 1 Hz to 100 kHz. This limit includes voltage ripple due to transmitter burst activity. Additional decoupling capacitors can be added to the main VCC line to filter noise into the device. SED (Smart Error Detection) The module uses a form of SED to track premature modem resets.
5 5: Software Interface Support Tools The EM7411 is compatible with the following support tools from Lantronix, Inc. and authorized third parties: • Firmware update utilities from Lantronix, Inc. • Lantronix, Inc. Logger • QXDM from QUALCOMM • QUALCOMM Product Support Tool (QPST) • Windows and Linux SDKs (including API and drivers) Host Interface The device supports the following protocols for modem communication: • MBIM (Mobile Broadband Interface Model) • Qualcomm QMI interface.
6: Mechanical and Environmental Specifications The EM7411 module complies with the mechanical and environmental specifications in Table 6-1. Final product conformance to these specifications depends on the OEM device implementation.
Mechanical and Environmental Specifications Electrostatic Discharge (ESD) The OEM is responsible for ensuring that the EM7411 host interface pins are not exposed to ESD during handling or normal operation. (See Table 6-1 on page 54 for specifications.) ESD protection is highly recommended for the SIM connector at the point where the contacts are exposed, and for any other signals from the host interface that would be subjected to ESD by the user of the product.
Product Technical Specification RF Baseband Figure 6-2: Copper Pad Location on Bottom Side of Module To enhance heat dissipation: • It is recommended to add a heat sink that mounts the module to the main PCB or metal chassis (a thermal compound or pads must be used between the module and the heat sink). • Maximize airflow over/around the module. • Locate the module away from other hot components.
7: Regulatory Compliance and Industry Certifications This module is designed to meet, and upon commercial release, will meet the requirements of the following regulatory bodies and regulations, where applicable: • Federal Communications Commission (FCC) of the United States • The Certification and Engineering Bureau of Industry Canada (IC) • Ministry of Internal Affairs and Communications (MIC) of Japan • Radio Equipment Directive (RED) of the European Union The EM7411 Embedded Module complies with the mand
Product Technical Specification 3. The EM7411 module may transmit simultaneously with other collocated radio transmitters within a host device, provided the following conditions are met: · Each collocated radio transmitter has been certified by FCC/IC for mobile application. · At least 20 cm separation distance between the antennas of the collocated transmitters and the user’s body must be maintained at all times.
Regulatory Compliance and Industry Certifications 5. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC/IC RF exposure guidelines. The end product with an embedded EM7411 module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15.
A A: Antenna Specification This appendix describes recommended electrical performance criteria for main path, diversity path, and GNSS antennas used with AirPrime embedded modules. The performance specifications described in this section are valid while antennas are mounted in the host device with antenna feed cables routed in their final application configuration.
Antenna Specification Table A-1: Antenna Requirements (Continued) a Parameter Requirements Radiation patterns of Ant1 and Ant2 Nominally Omni-directional radiation pattern in azimuth plane. Envelope correlation coefficient between Ant1 and Ant2 • • Comments < 0.5 on Rx bands below 960 MHz < 0.2 on Rx bands above 1.
Product Technical Specification Recommended GNSS Antenna Specifications Table A-2: GNSS Antenna Requirements Parameter Frequency range Requirements • • • • • • Comments Wide-band GNSS: 1559–1606 MHz recommended Narrow-band GPS: 1575.42 MHz ±2 MHz minimum Narrow-band Galileo: 1575.42 MHz ±2 MHz minimum Narrow-band BeiDou: 1561.098 MHz ±2 MHz minimum Narrow-band GLONASS: 1601.72 MHz ±4.2 MHz minimum Narrow-band QZSS: 1575.
Antenna Specification • • • All tests (except isolation/correlation coefficient)—Test the main or diversity antenna with the other antenna terminated. Any metallic part of the antenna system that is exposed to the outside environment needs to meet the electrostatic discharge tests per IEC61000-4-2 (conducted discharge +8kV). The functional requirements of the antenna system are tested and verified while the embedded module’s antenna is integrated in the host device.
B B: Design Checklist This chapter provides a summary of the design considerations mentioned throughout this guide. This includes items relating to the power interface, RF integration, thermal considerations, cabling issues, and so on. Note: This is NOT an exhaustive list of design considerations. It is expected that you will employ good design practices and engineering principles in your integration.
Design Checklist Table B-1: Hardware Integration Design Considerations (Continued) Suggestion Section where discussed If there is any potential ESD exposure to the primary antenna port, add 39 nH shunt induction to Ground as close as possible to the external connection. Provide ESD protection for the SIM connector at the exposed contact point (in particular, the CLK, VCC, IO, and RESET# lines). SIM Implementation on page 29 Keep very low capacitance traces on the UIM_DATA and UIM_CLK signals.
C C: Testing Note: All AirPrime embedded modules are factory-tested to ensure they conform to published product specifications. Developers of OEM devices integrating Lantronix, Inc. AirPrime embedded modules should include a series of test phases in their manufacturing process to make sure that their devices work properly with the embedded modules. Suggested phases include: • Acceptance Testing—Testing of modules when they are received from Lantronix, Inc.
Testing Acceptance Test Procedure The following is a suggested acceptance testing procedure using Lantronix, Inc.’ Skylight™ software: Note: You can perform these tests using appropriate AT commands. Test 1: Check Power-up and Initialization 1. After installing the module, start the test system. 2. Launch Skylight. 3. Check the LED—If the LED is off, there is a problem with the module or with the connection to the LED. Test 2: Check Version Numbers 1. From Skylight, select Help > About. 2.
Product Technical Specification Production Testing Note: Production testing typically continues for the life of the product. Production testing ensures that, for each assembled device, the module is installed correctly (I/O signals are passed between the host and module), and the antenna is connected and performing to specifications (RF tests).
Testing Production Test Procedure The following is a suggested test plan— you must decide which tests are appropriate for your product. You may wish to add additional tests that more fully exercise the capabilities of your product. Using an appropriate Dev Kit-based test station, and referring to the appropriate AT command references: 1. Visually inspect the module’s connectors and RF assemblies for obvious defects before installing it in the test station. 2.
Product Technical Specification 8. Unlock the extended AT command set. (Note: Use AT!ENTERCND? to check command syntax, which is SKU-dependent.): · AT!ENTERCND=”” 9. Put the module in diagnostic/factory test mode: · AT!DAFTMACT 10. Communicate with the SIM using +CPIN or +CIMI. When performing RF tests, use a test platform as described in Suggested Testing Equipment on page 79. 11. Test RF transmission, if desired: · (UMTS) See UMTS (WCDMA) RF Transmission Path Test on page 70.
Testing 1. Set up the power meter: Note: This procedure describes steps using the "Power Meter: Gigatronics 8651A” (with Option 12 and Power Sensor 80701A). a. Make sure the meter has been given sufficient time to warm up, if necessary, to enable it to take accurate measurements. b. Zero-calibrate the meter. c. Enable MAP mode. 2. Prepare the DUT using the following AT commands: a. AT!ENTERCND=”” (Unlock extended AT command set.) b. AT!DAFTMACT (Enter test mode.) c.
Product Technical Specification Note: When doing the same test over the air in an RF chamber, values are likely to be significantly lower. LTE RF Transmission Path Test Note: This procedure segment is performed in Step 11 of the Production Test Procedure on page 69. The suggested test procedure that follows uses the parameters in Table 3-2.. Table 3-2: Test Settings — LTE Transmission Path Band # Frequency (MHz) Band ID Channela 1900 MHz B2 1880.0 43 18900 1700 MHz B4 1732.
Testing To test the DUT’s transmitter path: 1. Set up the power meter: Note: This procedure describes steps using the “Power Meter: Gigatronics 8651A” (with Option 12 and Power Sensor 80701A). a. Make sure the meter has been given sufficient time to warm up, if necessary, to enable it to take accurate measurements. b. Zero-calibrate the meter. c. Enable MAP mode. 2. Prepare the DUT using the following AT commands: a. AT!ENTERCND=”” (Unlock extended AT command set.) b.
Product Technical Specification Note: The module has a nominal output power of +23 dBm ±1 dB in LTE mode. However, the value measured by the power meter is significantly influenced (beyond the stated ±1 dB output power tolerance) by the test setup (host RF cabling loss, antenna efficiency and pattern, test antenna efficiency and pattern, and choice of shield box). Note: When doing the same test over the air in an RF chamber, values are likely to be significantly lower.
Testing Note: This procedure describes steps using the Agilent 8648C signal generator—the Rohde & Schwarz SML03 is shown for reference only. a. Set the amplitude to: · -80 dBm b. Set the frequency for the band being tested. See Table 3-3 on page 74 for frequency values. 2. Set up the DUT: Warning: The maximum RF power level allowable on any RF port is +10dBm—damage may occur if this level is exceeded. a. AT!ENTERCND=”” (Unlock extended AT command set.) b.
Product Technical Specification LTE RF Receive Path Test Note: This procedure segment is performed in Step 12 of the Production Test Procedure on page 69. The suggested test procedure that follows uses the parameters in Table 3-4. Table 3-4: Test Settings — LTE Receive Path Band # Frequencya (MHz) Band ID Channelb 1900 MHz B2 1962.0 43 18900 1700 MHz B4 2134.5 42 20175 850 MHz B5 883.5 45 20525 2600 MHz B7 2657.0 35 21100 700 MHz B12 739.5 50 23095 700 MHz B13 753.
Testing To test the DUT’s receive path (or diversity path, while connected to the diversity antenna): 1. Set up the signal generator: Note: This procedure describes steps using the Agilent 8648C signal generator—the Rohde & Schwarz SML03 is shown for reference only. a. Set the amplitude to -70 dBm b. Set the frequency for the band being tested. See Table 3-4 for frequency values. 2.
Product Technical Specification · The Signal Generator power level can be adjusted and new limits found if the radiated test needs greater signal strength. · Monitor these limits during mass-production ramp-up to determine if further adjustments are needed. Note: The value measured from the DUT is significantly influenced by the test setup and DUT design (host RF cabling loss, antenna efficiency and pattern, test antenna efficiency and pattern, and choice of shield box).
Testing The following are some testing suggestions that can confirm that the antenna is interfaced properly, and that the RF module is calibrated and performs to specifications: • Module registration on cellular networks • Power consumption • Originate and terminate data and voice (if applicable) calls • Cell hand-off • Transmitter and receiver tests • FER (Frame Error Rate) as an indicator of receiver sensitivity/performance • Channel and average power measurements to verify that the device is transmittin
Product Technical Specification Extended AT Commands for Testing Lantronix, Inc. provides the [2] AirPrime EM75xx and EM/MC74x1 AT Command Reference (Doc# 41111748), which describes proprietary AT commands that may help in hardware integration design and testing (these commands are NOT intended for use by end users). Some commands from this document that may be useful for hardware integration are listed in Table 3-5 on page 80.
D D: Packaging Lantronix, Inc. AirPrime Embedded Modules are shipped in sealed boxes. The standard packaging (see Figure 4-1), contains a single tray with a capacity of 100 modules . (Note that some SKUs may have custom packaging—contact Lantronix, Inc. for SKU-specific details.) In the standard packaging, Embedded Modules are inserted, system connector first, into the bottom portion (T1) of a two-part tray. all facing the same direction.
Product Technical Specification The tray cover is secured to the tray base with ESD-safe tape (EP1) at the locations indicated. The tray is placed in a manufacturing box(B1), sealed with a security tape (P1), a manufacturing label (L3) is placed on the bottom-right corner, above the security tape, and if required a label (L4) is applied beside the manufacturing label. (See Figure 4-2.) If required (SKU-specific) Figure 4-2: Shipping Package Rev 5 May.
E E: References This guide deals specifically with hardware integration issues that are unique to AirPrime embedded modules. Lantronix, Inc. Documents The Lantronix, Inc. documents listed below are available from https://www.lantronix.com/. For additional documents describing embedded module design, usage, and integration issues, contact your Lantronix, Inc. account representative. Command Documents [1] AT Command Set for User Equipment (UE) (Release 6) (Doc# 3GPP TS 27.
F F: Acronyms Table F-1: Acronyms and Definitions Acronym or term Definition 3GPP 3rd Generation Partnership Project 8PSK Octagonal Phase Shift Keying AGC Automatic Gain Control A-GPS Assisted GPS API Application Programming Interface BeiDou BeiDou Navigation Satellite System A Chinese system that uses a series of satellites in geostationary and middle earth orbits to provide navigational data.
Acronyms Table F-1: Acronyms and Definitions (Continued) Acronym or term Definition EMC Electromagnetic Compatibility EMI Electromagnetic Interference ERP Effective Radiated Power ESD Electrostatic Discharge FCC Federal Communications Commission The U.S. federal agency that is responsible for interstate and foreign communications.
Product Technical Specification Table F-1: Acronyms and Definitions (Continued) Acronym or term Definition IC Industry Canada IF Intermediate Frequency IMEI International Mobile Equipment Identity IMS IP Multimedia Subsystem—Architectural framework for delivering IP multimedia services. inrush current Peak current drawn when a device is connected or powered on inter-RAT Radio Access Technology IOT Interoperability Testing IS Interim Standard.
Acronyms Table F-1: Acronyms and Definitions (Continued) Acronym or term Definition PA Power Amplifier packet A short, fixed-length block of data, including a header, that is transmitted as a unit in a communications network. PCB Printed Circuit Board PCC Primary Component Carrier PCS Personal Communication System A cellular communication infrastructure that uses the 1.9 GHz radio spectrum.
Product Technical Specification Table F-1: Acronyms and Definitions (Continued) Acronym or term Definition Sensitivity (RF) Measure of lowest power signal at the receiver input that can provide a prescribed BER/ BLER/SNR value at the receiver output. SG An LTE signaling interface for SMS (“SMS over SGs”) SIB System Information Block SIM Subscriber Identity Module. Also referred to as USIM or UICC.
Acronyms Table F-1: Acronyms and Definitions (Continued) Acronym or term Definition USIM Universal Subscriber Identity Module (UMTS) VCC Supply voltage VSWR Voltage Standing Wave Ratio WAN Wide Area Network WCDMA Wideband Code Division Multiple Access (also referred to as UMTS) WLAN Wireless Local Area Network ZIF Zero Intermediate Frequency ZUC ZUC stream cypher Rev 5 May.
Index Numerics carrier/operator testing, 79 cell selection, 14 certification tests, 67 checklist, design, 64 communications, host to modem design checklist, 65 conducted Tx power tolerances, 44 connection grounding, 38 connectors, required host-module, 15 control interface, 30 CQI, 14 3D gain, average gain 3D average (GNSS), 62 3GPP compliance LTE, 57 UMTS, 57 A acceptance tests, 66 accessories, 15 accuracy (GNSS), 44 acquisition time (GNSS), 44 acronyms and definitions, 84– 89 A-GNSS, 14 antenna connect
G M gain mean effective gain, 61 mean effective gain imbalance, 61 mechanical specifications, 54– 56 MIB, 14 modem features, 13 module power states, 48– 49 GNSS, 62 maximum, 57, 61 mean effective, 61 mean effective imbalance, 61 GNSS antenna specifications, recommended, 60, 62 GPS features supported, 14 specifications, 44 GPS_DISABLE#, 17, 30, 31 ground specifications, 25 grounding connection considerations, 38 N NAS/AS security, 14 noise leakage, minimizing, 38 RF interference, power supply, 52 H O
R SIM capacitor recommendations, 29 card contacts, 26, 28 clock rate, 29 connector, required, 15 electrical specifications, 29 impedance, connectors, 29 interface, 26 interface diagram, 28 operation, 29 SIM Detect, 17 Smart Error Detection detecting module reset, 52 SMS features, 14 Snow 3G/AES security, 14 software interface, 53 specifications electrical, 17 environmental specifications, 54– 56 GPS, 44 mechanical, 54– 56 RF, 36– 45 SSS, 14 standalone mode, GPS/GLONASS, 14 standby DC power consumption, av
timing power ramp-up, 50 power-up, 50 reset, 50 USB enumeration, 50 tracking session automatic, 14 standalone, 14 Tx power tolerances, conducted, 44 U UMTS 3GPP compliance, 57 USB drivers, user-developed, 26 high / full speed throughput performance, 26 interface, 25 USB enumeration timing, 50 USB3 design checklist, 64 V vibration specifications, 54 VSWR, 60, 62 W W_DISABLE#, 17, 30, 31 WAKE_ON_WAN#, 17 Wireless Disable, 30 Wireless Disable (GNSS), 31 Wireless Disable (Main RF), 31 WWAN_LED#, 30, 33 Z ZI
