User's Manual

PW2050 Embedded Device Server Integration Guide 26
Figure 錯誤! 使用 [常用] 索引標籤將 Heading 1 套用到您想要在此處顯示的文字。-2 PW2050
Recommended Footprint
The internal ground pads are used for module signal ground and thermal relief. The outer
layers should be flooded with ground and the ground pads should have many vias to the
internal ground layers.
Soldering coverage should be maximized and checked via x-ray for proper design. There is a
trade-off between providing enough soldering for conductivity and applying too much, which
allows the module to “float” on the pads creating reliability issues. Lantronix recommends 60%
or more full contact solder coverage on each of the internal ground pads after reflow. In
addition, Lantronix recommends that the solder wicks up at least 50% of the external LGA
pads for proper signal connection.
Solder Profile and Wash Instructions
The reflow profile is dependent on many factors including flux selection, solder composition,
and the capability of user's reflow equipment.