Product Info

LP
WA Module Series
BG95 Series Hardware Design
BG95_S
eries_Hardware_Design 100 / 106
Tab
le 57: Packaging Specifications of BG95
M
OQ for MP
M
inimum Package: 250
M
inimum Package × 4 = 1000
250
Si
ze: 370 mm × 350 mm × 56 mm
N.
W: 0.61 kg
G.W: 1.35 kg
Size: 380 mm × 250 mm × 365 mm
N.
W: 2.45 kg
G.W: 6.28 kg