Product Info

LP
WA Module Series
BG95 Series Hardware Design
BG95_S
eries_Hardware_Design 93 / 106
1.10
1.95
0.
55
1.
10
5.
10
1.00
8.50
0.85
1.70
1.00
1.00
1
.70
1.70
0.55
1.90
1.10
0.50
0
.70
0.25
0.25
0.25
23.60±0.15
4
0x1.0
4
0x1.0
62
x0.7
62x1.10
1.00
1.00
1.10
0.25
19.
90±0.15
Figur
e 35: Module Bottom Dimensions (Bottom View)
The package warpage level of the module conforms to JEITA ED-7306 standard.
Pin
1
NOT
E