Product Info

LP
WA Module Series
BG95 Series Hardware Design
BG95_S
eries_Hardware_Design 94 / 106
7.2. Re
commended Footprint
40x
1.0
40x1.0
62x0.7
62x1.10
19
.90±0.15
23.60±0.15
9.9
5
9
.95
7.
45
7.1
5
0.55
1.95
1
.10
1.10
9.1
5
9.1
5
1
.00
1.90
11.80 11.80
11.00 1
1.00
1.70
0.85
1.70
0.85
1.70
5.95 5.95
4
.25
4.
25
7.6
5
7.65
9
.70
9.
60
1.70
0.
85
2.55
4.25
5.95
4.25
5.95
1.70
1.70
2.50
2.50
1.
10
1.10
1.10
1.10
1
.10
0.70
1
.00
1.00
0.
20
0.15
1
.00
0.25
0.25
0.25
0.25
Figur
e 36: Recommended Footprint (Top View)
1. For
easy maintenance of the module, please keep about 3 mm between the module and other
co
mponents on the motherboard.
2. All R
ESERVED pins must be kept ope
n.
3. For st
encil design requirements of the module, see document [5].
NOTES
Pin 1