Product Info

LP
WA Module Series
BG95 Series Hardware Design
BG95_S
eries_Hardware_Design 98 / 106
Tab
le 56: Recommended Thermal Profile Parameters
8.3. Packag
ing
BG95 is pac
kaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until
the devices are ready to be soldered onto the application.
The reel is 330 mm in diameter and each reel contains 250 modules. The following figures show the
packaging details, measured in millimeter (mm).
Factor Recommendation
Soak Zone
Max
slope 1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C) 70–120 s
Re
flow Zone
Max
slope 2–3 °C/s
Reflow
time (D: over 220 °C) 45–70 s
Max
temperature 238–246 °C
Co
oling down slope -1.5 to -3 °C/s
Re
flow Cycle
Max
reflow cycle 1