Data Sheet
Table Of Contents
- Table of Contents
- List of Figures
- List of Tables
- 1: Functional Description
- 2: Hardware and Software Description
- xPico 200 Block Diagram
- Software Features
- Network Co-Processor Mode
- Wireless Microcontroller Mode
- TruPort Serial
- TruPort Socket
- Ethernet to Wi-Fi Bridge
- Concurrent Soft AP and Client Mode
- Enterprise Wi-Fi Security (802.11i, 802.1X/EAP)
- InfiniShield Security
- Wi-Fi Connection Profiles
- Configuration and Management Interface
- Reliable Firmware Over-The-Air (FOTA) Updates
- Power Management
- Pre-integration with MACH10 Platform
- Remote Gateway Management with Lantronix Gateway Central
- Integrated Bluetooth Classic and Bluetooth Low Energy Stacks (xPico 250)
- 3: Pin and Pad Definitions
- Note1: The current module supports an external 10/100 Mbps Ethernet PHY via the RMII interface.
- Note2: The logic IO pins are 3.3V tolerant.
- Note3: SMT Pins 67 to 75 are the ground pads under the module. These pads must be connected to ground. These pads also provide thermal relief for the module. It is recommended that multiple vias for each pad be used to connect the ground pads to t...
- Note 4: All unused IO pins may be left floating, except for the required straps on pins 17, 26, and 29.
- Note 5: Asterisk (*) indicates feature available in a future release. Contact your local sales representative for availability.
- Signal
- Pin
- Signal
- Pin
- Driver Strength
- Edge Connector Pin
- xPico 200 SMT Pin
- Primary Function
- Signal Name
- 4: Interfaces
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Type A USB Host Conn. Pin
- Signal Requirement
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Connector Pin
- xPico 200 SMT Pin
- Reset State
- Description
- Pin Name
- Edge Connector Pin
- xPico 200 SMT Pin
- Description
- Pin Name
- 5: IEEE 802.11 Wireless Lan Specifications
- Description
- Feature
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- 6: Bluetooth Specifications
- Description
- Feature
- 7: Antenna Connection Options
- Approved Region
- Vendor Part Number
- Vendor
- Lantronix Part Number
- Peak Gain Typical
- Antenna Type
- Peak Gain Typical
- Antenna Type
- 8: Electrical Characteristics
- Units
- Max xPico 250
- Max xPico 240
- Typical xPico 250
- TypicalxPico 240
- Soft AP
- Power Mgmt
- Parameter
- Units
- Max xPico 250
- Max xPico 240
- Typical xPico 250
- Typical xPico 240
- Soft AP
- Power Mgmt
- Parameter
- Units
- Peak Current Typical
- Average Current
- Soft AP/Wi-Fi Client
- Power Mgmt
- Parameter
- Unit
- Tolerance
- TYP.
- Rate
- Mode
- Unit
- Max
- TYP.
- Min.
- Rate
- Mode
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Max
- Rate
- Mode
- Typical
- Receiver Characteristics
- Unit
- Maximum
- Minimum
- Description
- Parameter
- Unit
- Maximum
- Minimum
- Description
- Parameter
- Unit
- Maximum
- Minimum
- Description
- Parameter
- 9: Package Description and Mechanical Footprint
- Description
- Category
- 10: Product Information Label
- Example
- Description
- Field
- 11: Compliance
- Labeling of the End Product
- Federal Communication Commission Interference Statement (xPico 240/250)
- Industry Canada Statement (xPico 240/250):
- Radiation Exposure Statement:
- Déclaration d'exposition aux radiations:
- This device is intended only for OEM integrators under the following conditions: (For module device use)
- Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositive module)
- IMPORTANT NOTE:
- NOTE IMPORTANTE:
- Plaque signalétique du produit final
- Manual Information To the End User
- Manuel d'information à l'utilisateur final
- Caution :
- Avertissement:
- RoHS, REACH, and WEEE Compliance Statement
- 12: Ordering Information
- Description
- Part Number
- Description
- Part Number
- Description
- Part Number
xPico
®
200 Series Embedded Wi-Fi
®
Gateway Data Sheet 26
5: IEEE 802.11 Wireless Lan Specifications
The table below provides the specifications and performance attributes for the xPico 200
module IEEE 802.11 radio.
Table 5-1: xPico 200 Module Radio Specification
Feature Description
Frequency Band
2.412 – 2.484 GHz (20Mhz channels)
5.18 to 5.845 GHz (20 and 40Mhz channels)
5.18 to 5.845 GHz (20, 40, and 80Mhz channels) (xPico 270 only)
Channels dependent on assigned country code. See channel list below.
Supported Data Rates
xPico 240/250
802.11abgn
a, b, g data rates up to 54 Mbps
n data rates up to MCS7
Supported Data Rates
xPico 270
802.11ac/abgn
a, b, g data rates up to 54 Mbps
n data rates up to MCS7
ac data rates up to MCS9
Modulation
OFDM with BPSK, QPSK, 16-QAM, 64-QAM (xPico 270 up to 256QAM)
IEEE 801.11b with CCK and DSSS
802.11 MAC Features
WEP, WPA, WPA2, WMM, WMM-PS (UAPSD), WMM-SA, AES, TKIP
802.11 Modes
a/b/g/n/d/h/I (xPico 270 includes ac)
Table 5-2: 20 MHz Channels
Frequency Channel FCC/USA Canada Europe Australia New
Zealand
Japan China
2.4 GHz Band
2412 1 Yes Yes Yes Yes Yes Yes Yes
2417 2 Yes Yes Yes Yes Yes Yes Yes
2422 3 Yes Yes Yes Yes Yes Yes Yes
2427 4 Yes Yes Yes Yes Yes Yes Yes
2432 5 Yes Yes Yes Yes Yes Yes Yes
2437 6 Yes Yes Yes Yes Yes Yes Yes
2442 7 Yes Yes Yes Yes Yes Yes Yes
2447 8 Yes Yes Yes Yes Yes Yes Yes
2452 9 Yes Yes Yes Yes Yes Yes Yes
2457 10 Yes Yes Yes Yes Yes Yes Yes
2462 11 Yes Yes Yes Yes Yes Yes Yes
2467 12 - - Yes Yes Yes Yes Yes
2472 13 - - Yes Yes Yes Yes Yes
2484 14 - - - - - - -