Data Sheet
Table Of Contents
- Table of Contents
- List of Figures
- List of Tables
- 1: Functional Description
- 2: Hardware and Software Description
- xPico 200 Block Diagram
- Software Features
- Network Co-Processor Mode
- Wireless Microcontroller Mode
- TruPort Serial
- TruPort Socket
- Ethernet to Wi-Fi Bridge
- Concurrent Soft AP and Client Mode
- Enterprise Wi-Fi Security (802.11i, 802.1X/EAP)
- InfiniShield Security
- Wi-Fi Connection Profiles
- Configuration and Management Interface
- Reliable Firmware Over-The-Air (FOTA) Updates
- Power Management
- Pre-integration with MACH10 Platform
- Remote Gateway Management with Lantronix Gateway Central
- Integrated Bluetooth Classic and Bluetooth Low Energy Stacks (xPico 250)
- 3: Pin and Pad Definitions
- Note1: The current module supports an external 10/100 Mbps Ethernet PHY via the RMII interface.
- Note2: The logic IO pins are 3.3V tolerant.
- Note3: SMT Pins 67 to 75 are the ground pads under the module. These pads must be connected to ground. These pads also provide thermal relief for the module. It is recommended that multiple vias for each pad be used to connect the ground pads to t...
- Note 4: All unused IO pins may be left floating, except for the required straps on pins 17, 26, and 29.
- Note 5: Asterisk (*) indicates feature available in a future release. Contact your local sales representative for availability.
- Signal
- Pin
- Signal
- Pin
- Driver Strength
- Edge Connector Pin
- xPico 200 SMT Pin
- Primary Function
- Signal Name
- 4: Interfaces
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Type A USB Host Conn. Pin
- Signal Requirement
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Connector Pin
- xPico 200 SMT Pin
- Reset State
- Description
- Pin Name
- Edge Connector Pin
- xPico 200 SMT Pin
- Description
- Pin Name
- 5: IEEE 802.11 Wireless Lan Specifications
- Description
- Feature
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- 6: Bluetooth Specifications
- Description
- Feature
- 7: Antenna Connection Options
- Approved Region
- Vendor Part Number
- Vendor
- Lantronix Part Number
- Peak Gain Typical
- Antenna Type
- Peak Gain Typical
- Antenna Type
- 8: Electrical Characteristics
- Units
- Max xPico 250
- Max xPico 240
- Typical xPico 250
- TypicalxPico 240
- Soft AP
- Power Mgmt
- Parameter
- Units
- Max xPico 250
- Max xPico 240
- Typical xPico 250
- Typical xPico 240
- Soft AP
- Power Mgmt
- Parameter
- Units
- Peak Current Typical
- Average Current
- Soft AP/Wi-Fi Client
- Power Mgmt
- Parameter
- Unit
- Tolerance
- TYP.
- Rate
- Mode
- Unit
- Max
- TYP.
- Min.
- Rate
- Mode
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Max
- Rate
- Mode
- Typical
- Receiver Characteristics
- Unit
- Maximum
- Minimum
- Description
- Parameter
- Unit
- Maximum
- Minimum
- Description
- Parameter
- Unit
- Maximum
- Minimum
- Description
- Parameter
- 9: Package Description and Mechanical Footprint
- Description
- Category
- 10: Product Information Label
- Example
- Description
- Field
- 11: Compliance
- Labeling of the End Product
- Federal Communication Commission Interference Statement (xPico 240/250)
- Industry Canada Statement (xPico 240/250):
- Radiation Exposure Statement:
- Déclaration d'exposition aux radiations:
- This device is intended only for OEM integrators under the following conditions: (For module device use)
- Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositive module)
- IMPORTANT NOTE:
- NOTE IMPORTANTE:
- Plaque signalétique du produit final
- Manual Information To the End User
- Manuel d'information à l'utilisateur final
- Caution :
- Avertissement:
- RoHS, REACH, and WEEE Compliance Statement
- 12: Ordering Information
- Description
- Part Number
- Description
- Part Number
- Description
- Part Number
xPico
®
200 Series Embedded Wi-Fi
®
Gateway Data Sheet 32
Dynamic Power Management Modes
The table below describes the power management modes for the xPico 200 module, along
with their typical and maximum current consumption values.
The xPico 200 module supports power-up and standby modes within its dynamic application-
aware power management framework.
Table 8-3: xPico 200 Power Consumption 2.4 Ghz (@3.3V, 25
o
C), Bluetooth Disabled
Parameter Power
Mgmt
Soft AP
Typical
xPico
240
Typical
xPico
250
Max
xPico
240
Max
xPico
250
Units
Boot sequence peak
N/A
N/A
580
600
mA
Idle current average-unit
connected to AP on client
11n Ch6
OFF
ON
95
123
mA
Idle current average-unit
connected to AP on client
11n Ch6
ON,
Beacon
100 ms,
DTIM 5
ON
95
123
mA
Idle current average unit
connected to AP on client
11n Ch6
ON,
Beacon
100 ms,
DTIM 5
OFF
41
66
mA
Iperf(UDP) in bridge mode to
AP on client interface
1 Mbps-Sustained
11n Ch6
ON,
Beacon
100 ms,
DTIM 5
OFF
95
128
mA
Transmitter surge,
11g 54 Mbps, 15dBm
N/A
N/A
345
379
399
427
mA
Transmitter surge, 11n, 20
Mhz BW, MCS7, 17 dBm
N/A
N/A
345
380
398
430
mA
Transmitter surge,
11g 54 Mbps, 0dBm
N/A
N/A
298
328
358
383
mA
Transmitter surge, 11n,
20 Mhz BW, MCS7, 0dBm
N/A
N/A
299
330
356
386
mA
Stand by, external IO
connections removed @+25C
N/A
N/A
30
uA
Stand by with external PHY,
other external IO connections
removed @ +25C
N/A
N/A
97
uA
Ethernet ping, Wi-Fi disabled.
External PHY current not
included
N/A
N/A
37
mA