Data Sheet
Table Of Contents
- Table of Contents
- List of Figures
- List of Tables
- 1: Functional Description
- 2: Hardware and Software Description
- xPico 200 Block Diagram
- Software Features
- Network Co-Processor Mode
- Wireless Microcontroller Mode
- TruPort Serial
- TruPort Socket
- Ethernet to Wi-Fi Bridge
- Concurrent Soft AP and Client Mode
- Enterprise Wi-Fi Security (802.11i, 802.1X/EAP)
- InfiniShield Security
- Wi-Fi Connection Profiles
- Configuration and Management Interface
- Reliable Firmware Over-The-Air (FOTA) Updates
- Power Management
- Pre-integration with MACH10 Platform
- Remote Gateway Management with Lantronix Gateway Central
- Integrated Bluetooth Classic and Bluetooth Low Energy Stacks (xPico 250)
- 3: Pin and Pad Definitions
- Note1: The current module supports an external 10/100 Mbps Ethernet PHY via the RMII interface.
- Note2: The logic IO pins are 3.3V tolerant.
- Note3: SMT Pins 67 to 75 are the ground pads under the module. These pads must be connected to ground. These pads also provide thermal relief for the module. It is recommended that multiple vias for each pad be used to connect the ground pads to t...
- Note 4: All unused IO pins may be left floating, except for the required straps on pins 17, 26, and 29.
- Note 5: Asterisk (*) indicates feature available in a future release. Contact your local sales representative for availability.
- Signal
- Pin
- Signal
- Pin
- Driver Strength
- Edge Connector Pin
- xPico 200 SMT Pin
- Primary Function
- Signal Name
- 4: Interfaces
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Type A USB Host Conn. Pin
- Signal Requirement
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Conn. Pin
- SMT Pin
- Description
- Pin Name
- Edge Connector Pin
- xPico 200 SMT Pin
- Reset State
- Description
- Pin Name
- Edge Connector Pin
- xPico 200 SMT Pin
- Description
- Pin Name
- 5: IEEE 802.11 Wireless Lan Specifications
- Description
- Feature
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- China
- Japan
- New Zealand
- Australia
- Europe
- Canada
- FCC/USA
- Channel
- Frequency
- 6: Bluetooth Specifications
- Description
- Feature
- 7: Antenna Connection Options
- Approved Region
- Vendor Part Number
- Vendor
- Lantronix Part Number
- Peak Gain Typical
- Antenna Type
- Peak Gain Typical
- Antenna Type
- 8: Electrical Characteristics
- Units
- Max xPico 250
- Max xPico 240
- Typical xPico 250
- TypicalxPico 240
- Soft AP
- Power Mgmt
- Parameter
- Units
- Max xPico 250
- Max xPico 240
- Typical xPico 250
- Typical xPico 240
- Soft AP
- Power Mgmt
- Parameter
- Units
- Peak Current Typical
- Average Current
- Soft AP/Wi-Fi Client
- Power Mgmt
- Parameter
- Unit
- Tolerance
- TYP.
- Rate
- Mode
- Unit
- Max
- TYP.
- Min.
- Rate
- Mode
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Maximum
- Maximum RF Receive Level
- Unit
- Max
- Rate
- Mode
- Typical
- Receiver Characteristics
- Unit
- Maximum
- Minimum
- Description
- Parameter
- Unit
- Maximum
- Minimum
- Description
- Parameter
- Unit
- Maximum
- Minimum
- Description
- Parameter
- 9: Package Description and Mechanical Footprint
- Description
- Category
- 10: Product Information Label
- Example
- Description
- Field
- 11: Compliance
- Labeling of the End Product
- Federal Communication Commission Interference Statement (xPico 240/250)
- Industry Canada Statement (xPico 240/250):
- Radiation Exposure Statement:
- Déclaration d'exposition aux radiations:
- This device is intended only for OEM integrators under the following conditions: (For module device use)
- Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositive module)
- IMPORTANT NOTE:
- NOTE IMPORTANTE:
- Plaque signalétique du produit final
- Manual Information To the End User
- Manuel d'information à l'utilisateur final
- Caution :
- Avertissement:
- RoHS, REACH, and WEEE Compliance Statement
- 12: Ordering Information
- Description
- Part Number
- Description
- Part Number
- Description
- Part Number
xPico
®
200 Series Embedded Wi-Fi
®
Gateway Data Sheet 34
Table 8-5: xPico 250/270 Power Consumption with Bluetooth Enabled (@3.3V, 25
o
C)
Parameter Power
Mgmt
Soft AP/
Wi-Fi
Client
Average
Current
Peak
Current
Typical
Units
BLE peripheral not connected. Wi-Fi client
and soft AP disabled
OFF
Disable
44
120
mA
BLE peripheral not connected. Wi-Fi Client
connected (2.4Ghz) ping. Soft AP enabled.
OFF
Enabled
110
556
mA
BLE peripheral not connected. Wi-Fi Client
connected (5Ghz) ping. Soft AP enabled.
OFF
Enabled
124
600
mA
BLE peripheral connected. Wi-Fi client and
soft AP disabled
OFF
Disabled
45
121
mA
BLE peripheral connected. Wi-Fi Client
connected (2.4Ghz) ping. Soft AP enabled.
OFF
Enabled
112
556
mA
BLE peripheral connected. Wi-Fi Client
connected (5Ghz) ping. Soft AP enabled.
OFF
Enabled
126
600
mA
Output Power
The xPico 200 module RF output power is listed in the Table 8-6 below.
Table 8-6: xPico 200 Module RF Output Power (Wi-Fi Conducted)
Mode Rate TYP. Tolerance Unit
RF Average Output Power, 802.11b
1 Mbps 17 + 5 dBm
54 Mbps
15
+ 2
dBm
11 Mbps 17 + 5 dBm
RF Average Output Power, 802.11g
6 Mbps 15 + 2 dBm
RF Average Output Power, 802.11n (2.4Ghz)
MCS0
15
+ 2
dBm
54 Mbps 20 + 2 dBm
RF Average Output Power, 802.11n (5Ghz)
MCS0 20 + 2 dBm
MCS7 15 + 2 dBm
RF Average Output Power, 802.11a
6 Mbps 15 + 2 dBm
MCS7 20 + 2 dBm
Table 8-7: xPico 200 Module RF Output Power (BT Conducted)
Mode Rate Min. TYP. Max Unit
RF Average Output Power
BLE
6
1
dBm
Power Class 1
2
BR/EDR
0
20
dBm
Power Class 2
2
BR/EDR
-6
3
4
dBm
Power Class 3
2
BR/EDR
0
dBm
Note 1: Max EIRP for BLE 10dBm per BT specification
Note 2: Refer to BT Sig power transmitter power specifications